Systems for performing instructions to quickly convert and use tiles as 1d vectors

ABSTRACT

Disclosed embodiments relate to systems for performing instructions to quickly convert and use matrices (tiles) as one-dimensional vectors. In one example, a processor includes fetch circuitry to fetch an instruction having fields to specify an opcode, locations of a two-dimensional (2D) matrix and a one-dimensional (1D) vector, and a group of elements comprising one of a row, part of a row, multiple rows, a column, part of a column, multiple columns, and a rectangular sub-tile of the specified 2D matrix, and wherein the opcode is to indicate a move of the specified group between the 2D matrix and the 1D vector, decode circuitry to decode the fetched instruction; and execution circuitry, responsive to the decoded instruction, when the opcode specifies a move from 1D, to move contents of the specified 1D vector to the specified group of elements.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present patent application is a continuation application claimingpriority from U.S. patent application Ser. No. 17/240,882 filed Apr. 26,2021, which is a continuation application claiming priority from U.S.patent application Ser. No. 16/145,066 filed Sep. 27, 2018, each ofwhich is incorporated herein by reference in its entirety.

FIELD OF INVENTION

The field of invention relates generally to computer processorarchitecture, and, more specifically, to systems and methods forperforming instructions to quickly convert and use matrices asone-dimensional vectors.

BACKGROUND

Matrices are increasingly important in many computing tasks such asmachine learning and other bulk data processing. Deep Learning is aclass of machine learning algorithms. Deep learning architectures, suchas deep neural networks, have been applied to fields including computervision, speech recognition, natural language processing, audiorecognition, social network filtering, machine translation,bioinformatics and drug design.

Inference and training, two tools used for deep learning, are tendingtowards low precision arithmetic. Maximizing throughput of deep learningalgorithms and computations may assist in meeting the needs of deeplearning processors, for example, those performing deep learning in adata center.

Instructions for performing direct moves of elements between2-dimensional (2D) matrices and 1-dimensional (1D) vector registerswould improve matrix operations by leveraging useful execution hardwaretargeted for the classic 1D vector operations.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and notlimitation in the figures of the accompanying drawings, in which likereferences indicate similar elements and in which:

FIG. 1A illustrates an embodiment of configured tiles;

FIG. 1B illustrates an embodiment of configured tiles;

FIG. 2 illustrates several examples of matrix storage;

FIG. 3 illustrates an embodiment of a system utilizing a matrix (tile)operations accelerator;

FIGS. 4 and 5 show different embodiments of how memory is shared using amatrix operations accelerator;

FIG. 6 illustrates an embodiment of matrix multiply accumulate operationusing tiles (“TMMA”);

FIG. 7 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction;

FIG. 8 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction;

FIG. 9 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction;

FIG. 10 illustrates an embodiment of a subset of the execution of aniteration of chained fused multiply accumulate instruction;

FIG. 11 illustrates power-of-two sized SIMD implementations wherein theaccumulators use input sizes that are larger than the inputs to themultipliers according to an embodiment;

FIG. 12 illustrates an embodiment of a system utilizing matrixoperations circuitry;

FIG. 13 illustrates an embodiment of a processor core pipelinesupporting matrix operations using tiles;

FIG. 14 illustrates an embodiment of a processor core pipelinesupporting matrix operations using tiles;

FIG. 15 illustrates an example of a matrix expressed in row major formatand column major format;

FIG. 16 illustrates an example of usage of matrices (tiles);

FIG. 17 illustrates an embodiment a method of usage of matrices (tiles);

FIG. 18 illustrates support for configuration of the usage of tilesaccording to an embodiment;

FIG. 19 illustrates an embodiment of a description of the matrices(tiles) to be supported;

FIGS. 20(A)-(D) illustrate examples of register(s);

FIG. 21 illustrates an exemplary execution of a TileMoveTo1D instructionaccording to some embodiments of the invention;

FIG. 22 illustrates an exemplary execution of a TileMoveFrom1Dinstruction according to some embodiments of the invention;

FIG. 23A is a flow diagram illustrating an embodiment of a processorperforming a processor executing a TileMoveTo1D instruction, accordingto some embodiments;

FIG. 23B is a flow diagram illustrating an embodiment of a processorperforming a processor executing a TileMoveFrom1D instruction, accordingto some embodiments;

FIG. 24 is a block diagram illustrating a format of a TileMoveTo1Dinstruction, according to some embodiments;

FIGS. 25A-25B are block diagrams illustrating a generic vector friendlyinstruction format and instruction templates thereof according toembodiments of the invention;

FIG. 25A is a block diagram illustrating a generic vector friendlyinstruction format and class A instruction templates thereof accordingto embodiments of the invention;

FIG. 25B is a block diagram illustrating the generic vector friendlyinstruction format and class B instruction templates thereof accordingto embodiments of the invention;

FIG. 26A is a block diagram illustrating an exemplary specific vectorfriendly instruction format according to embodiments of the invention;

FIG. 26B is a block diagram illustrating the fields of the specificvector friendly instruction format that make up the full opcode fieldaccording to one embodiment of the invention;

FIG. 26C is a block diagram illustrating the fields of the specificvector friendly instruction format that make up the register index fieldaccording to one embodiment of the invention;

FIG. 26D is a block diagram illustrating the fields of the specificvector friendly instruction format that make up the augmentationoperation field according to one embodiment of the invention;

FIG. 27 is a block diagram of a register architecture according to oneembodiment of the invention;

FIG. 28A is a block diagram illustrating both an exemplary in-orderpipeline and an exemplary register renaming, out-of-orderissue/execution pipeline according to embodiments of the invention;

FIG. 28B is a block diagram illustrating both an exemplary embodiment ofan in-order architecture core and an exemplary register renaming,out-of-order issue/execution architecture core to be included in aprocessor according to embodiments of the invention;

FIGS. 29A-B illustrate a block diagram of a more specific exemplaryin-order core architecture, which core would be one of several logicblocks (including other cores of the same type and/or different types)in a chip;

FIG. 29A is a block diagram of a single processor core, along with itsconnection to the on-die interconnect network and with its local subsetof the Level 2 (L2) cache, according to embodiments of the invention;

FIG. 29B is an expanded view of part of the processor core in FIG. 29Aaccording to embodiments of the invention;

FIG. 30 is a block diagram of a processor that may have more than onecore, may have an integrated memory controller, and may have integratedgraphics according to embodiments of the invention;

FIGS. 31-34 are block diagrams of exemplary computer architectures;

FIG. 31 shown a block diagram of a system in accordance with oneembodiment of the present invention;

FIG. 32 is a block diagram of a first more specific exemplary system inaccordance with an embodiment of the present invention;

FIG. 33 is a block diagram of a second more specific exemplary system inaccordance with an embodiment of the present invention;

FIG. 34 is a block diagram of a System-on-a-Chip (SoC) in accordancewith an embodiment of the present invention; and

FIG. 35 is a block diagram contrasting the use of a software instructionconverter to convert binary instructions in a source instruction set tobinary instructions in a target instruction set according to embodimentsof the invention.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth.However, it is understood that embodiments of the invention may bepracticed without these specific details. In other instances, well-knowncircuits, structures and techniques have not been shown in detail inorder not to obscure the understanding of this description.

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedmay include a particular feature, structure, or characteristic, butevery embodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

In many mainstream processors, handling matrices is a difficult and/orinstruction intensive task. For example, rows of a matrix could be putinto a plurality of packed data (e.g., SIMD or vector) registers andthen operated on individually. For example, an add two 8×2 matrices mayrequire a load or gather into four packed data registers depending upondata sizes. Then a first add of packed data registers corresponding to afirst row from each matrix is performed and a second add of packed dataregisters corresponding to a second row from each matrix is performed.Then the resulting packed data registers are scattered back to memory.While for small matrices this scenario may be acceptable, it is oftennot acceptable with larger matrices.

Discussion

Described herein are mechanisms to support matrix operations in computerhardware such as central processing units (CPUs), graphic processingunits (GPUs), and accelerators. The matrix operations utilize2-dimensional (2-D) data structures representing one or more packedregions of memory such as registers. Throughout this description, these2-D data structures are referred to as tiles. Note that a matrix may besmaller than a tile (use less than all of a tile) or utilize a pluralityof tiles (the matrix is larger than the size of any one tile).Throughout the description, matrix (tile) language is used to indicateoperations performed using tiles that impact a matrix; whether or notthat matrix is larger than any one tile is not typically relevant.

Each tile may be acted upon by different operations such as those thatare detailed herein and include, but are not limited to: matrix (tile)multiplication, tile add, tile subtract, tile diagonal, tile zero, tiletranspose, tile dot product, tile broadcast, tile row broadcast, tilecolumn broadcast, tile multiplication, tile multiplication andaccumulation, tile move, etc. Additionally, support for operators suchas the use of a scale and/or bias may be used with these operations orin support of non-numeric applications in the future, for instance,OpenCL “local memory,” data compression/decompression, etc. Alsodescribed herein are instructions for performing TileMoveTo1D andTileMoveFrom1D instructions.

Portions of storage (such as memory (non-volatile and volatile),registers, cache, etc.) are arranged into tiles of different horizontaland vertical dimensions. For example, a tile may have horizontaldimension of 4 (e.g., four rows of a matrix) and a vertical dimension of8 (e.g., 8 columns of the matrix). Typically, the horizontal dimensionis related to element sizes (e.g., 2-, 4-, 8-, 16-, 32-, 64-, 128-bit,etc.). Multiple datatypes (single precision floating point, doubleprecision floating point, integer, etc.) may be supported.

Exemplary Usage of Configured Tiles

In some embodiments, tile parameters can be configured. For example, agiven tile may be configured to provide tile options. Exemplary tileoptions include but are not limited to: a number of rows of the tile, anumber of columns of the tile, whether the tile is VALID, and whetherthe tile consists of a PAIR of equal-sized tiles.

FIG. 1A illustrates an embodiment of configured tiles. As shown, 4 kB ofapplication memory 102 have stored thereon 4 1 kB titles, tile t0 104,tile t1 106, tile t2 108, and tile t3 110. In this example, the 4 tilesdo not consist of pairs, and each have elements arranged in rows andcolumns. Tile t0 104 and tile t1 106 have K rows and N columns of 4-byteelements (e.g., single precision data), where K equals 8 and N=32. Tilet2 108 and tile t3 110 have K rows and N/2 columns of 8-byte elements(e.g., double precision data). As the double precision operands aretwice the width of single precision, this configuration is consistentwith a palette, used to provide tile options, supplying at least 4 nameswith total storage of at least 4 kB. In operation, the tiles can beloaded from and stored to memory using load and store operations.Depending upon the instruction encoding scheme used, the amount ofavailable application memory, as well as the size, number, andconfiguration of available tiles varies.

FIG. 1B illustrates an embodiment of configured tiles. As shown, 4 kB ofapplication memory 122 have stored thereon 2 pairs of 1 kB-titles, thefirst pair being tile t4L 124 and tile t4R 126, and the second pairbeing tile t5L 128 and tile t5R 130. As shown the pairs of tiles aredivided into a left tile and a right tile. In other embodiments, thepair of tiles are divided into an even tile and an odd tile. In thisexample, the 4 tiles each have elements arranged in rows and columns.Tile t4L 124 and tile t4R 126 have K rows and N columns of 4-byteelements (e.g., single precision floating point data), where K equals 8and N equals 32. Tile t5L 128 and tile t5R 130 have K rows and N/2columns of 8-byte elements (e.g., double precision floating point data).As the double precision operands are twice the width of singleprecision, this configuration is consistent with a palette, used toprovide tile options, supplying at least 2 names with total storage ofat least 4 kB. The four tiles of FIG. 1A use 4 names, each naming a 1 kBtile, whereas the 2 pairs of tiles in FIG. 1B can use 2 names to specifythe paired tiles. In some embodiments, tile instructions accept a nameof a paired tile as an operand. In operation, the tiles can be loadedfrom and stored to memory using load and store operations. Dependingupon the instruction encoding scheme used, the amount of availableapplication memory, as well as the size, number, and configuration ofavailable tiles varies.

In some embodiments, tile parameters are definable. For example, a“palette” is used to provide tile options. Exemplary options include,but are not limited to: the number of tile names, the number of bytes ina row of storage, the number of rows and columns in a tile, etc. Forexample, a maximum “height” (number of rows) of a tile may be definedas:

Tile Max Rows=Architected Storage/(The Number of Palette Names*TheNumber of Bytes per row).

As such, an application can be written such that a fixed usage of nameswill be able to take advantage of different storage sizes acrossimplementations.

Configuration of tiles is done using a tile configuration (“TILECONFIG”)instruction, where a particular tile usage is defined in a selectedpalette. This declaration includes the number of tile names to be used,the requested number of rows and columns per name (tile), and, in someembodiments, the requested datatype of each tile. In some embodiments,consistency checks are performed during the execution of a TILECONFIGinstruction to determine that it matches the restrictions of the paletteentry.

Exemplary Tile Storage Types

FIG. 2 illustrates several examples of matrix storage. In (A), a tile isstored in memory. As shown, each “row” consists of four packed dataelements. To get to the next “row,” a stride value is used. Note thatrows may be consecutively stored in memory. Strided memory accessesallows for access of one row to then next when the tile storage does notmap the underlying memory array row width.

Tile loads from memory and stores to memory are typically stridedaccesses from the application memory to packed rows of data. ExemplaryTILELOAD and TILESTORE instructions, or other instruction references toapplication memory as a TILE operand in load-op instructions, are, insome embodiments, restartable to handle (up to) 2*rows of page faults,unmasked floating point exceptions, and/or interrupts per instruction.

In (B), a matrix is stored in a tile comprised of a plurality ofregisters such as packed data registers (single instruction, multipledata (SIMD) or vector registers). In this example, the tile is overlaidon three physical registers. Typically, consecutive registers are used,however, this need not be the case.

In (C), a matrix is stored in a tile in non-register storage accessibleto a fused multiple accumulate (FMA) circuit used in tile operations.This storage may be inside of a FMA, or adjacent to it. Additionally, insome embodiments, discussed below, the storage may be for a data elementand not an entire row or tile.

The supported parameters for the TMMA architecture are reported viaCPUID. In some embodiments, the list of information includes a maximumheight and a maximum SIMD dimension. Configuring the TMMA architecturerequires specifying the dimensions for each tile, the element size foreach tile and the palette identifier. This configuration is done byexecuting the TILECONFIG instruction.

Successful execution of a TILECONFIG instruction enables subsequent TILEoperators. A TILERELEASEALL instruction clears the tile configurationand disables the TILE operations (until the next TILECONFIG instructionsexecutes). In some embodiments, XSAVE, XSTORE, etc. are used in contextswitching using tiles. In some embodiments, 2 XCR0 bits are used inXSAVE, one for TILECONFIG metadata and one bit corresponding to actualtile payload data.

TILECONFIG not only configures the tile usage, but also sets a statevariable indicating that the program is in a region of code with tilesconfigured. An implementation may enumerate restrictions on otherinstructions that can be used with a tile region such as no usage of anexisting register set, etc.

Exiting a tile region is typically done with the TILERELEASEALLinstruction. It takes no parameters and swiftly invalidates all tiles(indicating that the data no longer needs any saving or restoring) andclears the internal state corresponding to being in a tile region.

In some embodiments, tile operations will zero any rows and any columnsbeyond the dimensions specified by the tile configuration. For example,tile operations will zero the data beyond the configured number ofcolumns (factoring in the size of the elements) as each row is written.For example, with 64-byte rows and a tile configured with 10 rows and 12columns, an operation writing FP32 elements would write each of thefirst 10 rows with 12*4 bytes with output/result data and zero theremaining 4*4 bytes in each row. Tile operations also fully zero anyrows after the first 10 configured rows. When using 1K tile with 64-byterows, there would be 16 rows, so in this example, the last 6 rows wouldalso be zeroed.

In some embodiments, a context restore instruction (e.g., XRSTOR), whenloading data, enforces that the data beyond the configured rows for atile will be maintained as zero. If there is no valid configuration, allrows are zeroed. XRSTOR of tile data can load garbage in the columnsbeyond those configured. It should not be possible for XRSTOR to clearbeyond the number of columns configured because there is not an elementwidth associated with the tile configuration.

Context save (e.g., XSAVE) exposes the entire TILE storage area whenwriting it to memory. If XRSTOR loaded garbage data in to the rightmostpart of a tile, that data will be saved by XSAVE. XSAVE will write zerosfor rows beyond the number specified for each tile.

In some embodiments, tile instructions are restartable. The operationsthat access memory allow restart after page faults. The computationalinstructions that deal with floating point operations also allow forunmasked floating-point exceptions, with the masking of the exceptionscontrolled by a control and/or status register.

To support restarting instructions after these events, the instructionsstore information in the start registers detailed below.

Matrix (Tile) Operation Systems Exemplary Hardware Support

FIG. 3 illustrates an embodiment of a system utilizing a matrix (tile)operations accelerator. In this illustration, a hostprocessor/processing system 301 communicates commands 311 (e.g., matrixmanipulation operations such as arithmetic or matrix manipulationoperations, or load and store operations) to a matrix operationsaccelerator 307. However, this is shown this way for discussion purposesonly. As detailed later, this accelerator 307 may be a part of aprocessing core. Typically, commands 311 that are tile manipulationoperator instructions will refer to tiles as register-register(“reg-reg”) or register-memory (“reg-mem”) format. Other commands suchas TILESTORE, TILELOAD, TILECONFIG, etc., do not perform data operationson a tile. Commands may be decoded instructions (e.g., micro-ops) ormacro-instructions for the accelerator 307 to handle.

In this example, a coherent memory interface 303 is coupled to the hostprocessor/processing system 301 and matrix operations accelerator 307such that they can share memory. FIGS. 4 and 5 show differentembodiments of how memory is shared using a matrix operationsaccelerator. As shown in FIG. 4, the host processor 401 and matrixoperations accelerator circuitry 405 share the same memory 403. FIG. 5illustrates an embodiment where the host processor 501 and matrixoperations accelerator 505 do not share memory but can access eachother's memory. For example, processor 501 can access tile memory 507and utilize its host memory 503 as normal. Similarly, the matrixoperations accelerator 505 can access host memory 503, but moretypically uses its own memory 507. Note these memories may be ofdifferent types.

In some embodiments, tiles are supported using an overlay over physicalregisters. For example, a tile may utilize 16 1,024-bit registers, 32512-bit registers, etc. depending on the implementation. In someembodiments, the matrix operations utilize 2-dimensional (2-D) datastructures representing one or more packed regions of memory such asregisters. Throughout this description, these 2-D data structures arereferred to as tiles or tile registers.

In some embodiments, the matrix operations accelerator 307 includes aplurality of FMAs 309 coupled to data buffers 305 (in someimplementations, one or more of these buffers 305 are stored in the FMAsof the grid as shown). The data buffers 305 buffer tiles loaded frommemory and/or tiles to be stored to memory (e.g., using a tileload ortilestore instruction). Data buffers may be, for example, a plurality ofregisters. Typically, these FMAs are arranged as a grid of chained FMAs309 which are able to read and write tiles. In this example, the matrixoperations accelerator 307 is to perform a matrix multiply operationusing tiles T0, T1, and T2. At least one of tiles is housed in the FMAgrid 309. In some embodiments, all tiles in an operation are stored inthe FMA grid 309. In other embodiments, only a subset is stored in theFMA grid 309. As shown, T1 is housed and T0 and T2 are not. Note that A,B, and C refer to the matrices of these tiles which may or may not takeup the entire space of the tile.

FIG. 6 illustrates an embodiment of matrix multiply accumulate operationusing tiles (“TMMA”).

The number of rows in the matrix (TILE A 601) matches the number ofserial (chained) FMAs comprising the computation's latency. Animplementation is free to recirculate on a grid of smaller height, butthe computation remains the same.

The source/destination vector comes from a tile of N rows (TILE C 605)and the grid of FMAs 611 performs N vector-matrix operations resultingin a complete instruction performing a matrix multiplication of tiles.Tile B 603 is the other vector source and supplies “broadcast” terms tothe FMAs in each stage.

In operation, in some embodiments, the elements of matrix B (stored in atile B 603) are spread across the rectangular grid of FMAs. Matrix B(stored in tile A 601) has its elements of a row transposed to match upwith the columnar dimension of the rectangular grid of FMAs. At each FMAin the grid, an element of A and B are multiplied and added to theincoming summand (from above in the Figure) and the outgoing sum ispassed to the next row of FMAs (or the final output).

The latency of a single step is proportional to K (row height of matrixB) and dependent TMMAs typically have enough source-destination rows(either in a single tile or across tile) to hide that latency. Animplementation may also split the SIMD (packed data element) dimension M(row height of matrix A) across time steps, but this simply changes theconstant that K is multiplied by. When a program specifies a smaller Kthan the maximum enumerated by the TMACC, an implementation is free toimplement this with “masking” or “early outs.”

The latency of an entire TMMA is proportional to N*K. The repeat rate isproportional to N. The number of MACs per TMMA instruction is N*K*M.

FIG. 7 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction. Inparticular, this illustrates execution circuitry of an iteration of onepacked data element position of the destination. In this embodiment, thechained fused multiply accumulate is operating on signed sources whereinthe accumulator is 2× the input data size.

A first signed source (source 1 701) and a second signed source (source2 703) each have four packed data elements. Each of these packed dataelements stores signed data such as floating-point data. A third signedsource (source 3 709) has two packed data elements, each of which storessigned data. The sizes of the first and second signed sources 701 and703 are half that of the third signed source (initial value or previousresult) 709. For example, the first and second signed sources 701 and703 could have 32-bit packed data elements (e.g., single precisionfloating point) while the third signed source 709 could have 64-bitpacked data elements (e.g., double precision floating point).

In this illustration, only the two most significant packed data elementpositions of the first and second signed sources 701 and 703 and themost significant packed data element position of the third signed source709 are shown. Of course, the other packed data element positions wouldalso be processed.

As illustrated, packed data elements are processed in pairs. Forexample, the data of the most significant packed data element positionsof the first and second signed sources 701 and 703 are multiplied usinga multiplier circuit 705, and the data from second most significantpacked data element positions of the first and second signed sources 701and 703 are multiplied using a multiplier circuit 707. In someembodiments, these multiplier circuits 705 and 707 are reused for otherpacked data elements positions. In other embodiments, additionalmultiplier circuits are used so that the packed data elements areprocessed in parallel. In some contexts, parallel execution is doneusing lanes that are the size of the signed third source 709. Theresults of each of the multiplications are added using additioncircuitry 711.

The result of the addition of the results of the multiplications isadded to the data from most significant packed data element position ofthe signed source 3 709 (using a different adder 713 or the same adder711).

Finally, the result of the second addition is either stored into thesigned destination 715 in a packed data element position thatcorresponds to the packed data element position used from the signedthird source 709 or passed on to the next iteration if there is one. Insome embodiments, a writemask is applied to this storage such that if acorresponding writemask (bit) is set, the storage happens, and, if notset, the storage does not happen.

FIG. 8 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction. Inparticular, this illustrates execution circuitry of an iteration of onepacked data element position of the destination. In this embodiment, thechained fused multiply accumulate is operating on signed sources whereinthe accumulator is 2× the input data size.

A first signed source (source 1 801) and a second signed source (source2 803) each have four packed data elements. Each of these packed dataelements stores signed data such as integer data. A third signed source(source 3 809) has two packed data elements, each of which stores signeddata. The sizes of the first and second signed sources 801 and 803 arehalf that of the third signed source 809. For example, the first andsecond signed sources 801 and 803 could have 32-bit packed data elements(e.g., single precision floating point) the third signed source 809could have 64-bit packed data elements (e.g., double precision floatingpoint).

In this illustration, only the two most significant packed data elementpositions of the first and second signed sources 801 and 803 and themost significant packed data element position of the third signed source809 are shown. Of course, the other packed data element positions wouldalso be processed.

As illustrated, packed data elements are processed in pairs. Forexample, the data of the most significant packed data element positionsof the first and second signed sources 801 and 803 are multiplied usinga multiplier circuit 805, and the data from second most significantpacked data element positions of the first and second signed sources 801and 803 are multiplied using a multiplier circuit 807. In someembodiments, these multiplier circuits 805 and 807 are reused for otherpacked data elements positions. In other embodiments, additionalmultiplier circuits are used so that the packed data elements areprocessed in parallel. In some contexts, parallel execution is doneusing lanes that are the size of the signed third source (initial valueor previous iteration result) 809. The results of each of themultiplications are added to the signed third source 809 usingaddition/saturation circuitry 813.

Addition/saturation (accumulator) circuitry 813 preserves a sign of anoperand when the addition results in a value that is too big. Inparticular, saturation evaluation occurs on the infinite precisionresult between the multi-way-add and the write to the destination ornext iteration. When the accumulator 813 is floating point and the inputterms are integer, the sum of products and the floating-pointaccumulator input value are turned into infinite precision values (fixedpoint numbers of hundreds of bits), the addition of the multiplicationresults and the third input is performed, and a single rounding to theactual accumulator type is performed.

Unsigned saturation means the output values are limited to a maximumunsigned number for that element width (all 1s). Signed saturation meansa value is limited to the be in the range between a minimum negativenumber and a max positive number for that element width (for bytes forexample, the range is from −128 (=−2{circumflex over ( )}7) to 127(=2{circumflex over ( )}7−1)).

The result of the addition and saturation check is stored into thesigned result 815 in a packed data element position that corresponds tothe packed data element position used from the signed third source 809or passed on to the next iteration if there is one. In some embodiments,a writemask is applied to this storage such that if a correspondingwritemask (bit) is set, the storage happens, and, if not set, thestorage does not happen.

FIG. 9 illustrates an embodiment of a subset of the execution of aniteration of a chained fused multiply accumulate instruction. Inparticular, this illustrates execution circuitry of an iteration of onepacked data element position of the destination. In this embodiment, thechained fused multiply accumulate is operating on a signed source and anunsigned source wherein the accumulator is 4× the input data size.

A first signed source (source 1 901) and a second unsigned source(source 2 903) each have four packed data elements. Each of these packeddata elements has data such as floating point or integer data. A thirdsigned source (initial value or result 915) has a packed data element ofwhich stores signed data. The sizes of the first and second sources 901and 903 are a quarter of the third signed source 915. For example, thefirst and second sources 901 and 903 could have 16-bit packed dataelements (e.g., word) and the third signed source 915 could have 64-bitpacked data elements (e.g., double precision floating point or 64-bitinteger).

In this illustration, the four most significant packed data elementpositions of the first and second sources 901 and 903 and the mostsignificant packed data element position of the third signed source 915are shown. Of course, other packed data element positions would also beprocessed if there are any.

As illustrated, packed data elements are processed in quadruplets. Forexample, the data of the most significant packed data element positionsof the first and second sources 901 and 903 are multiplied using amultiplier circuit 905, data from second most significant packed dataelement positions of the first and second sources 901 and 903 aremultiplied using a multiplier circuit 907, data from third mostsignificant packed data element positions of the first and secondsources 901 and 903 are multiplied using a multiplier circuit 909, anddata from the least significant packed data element positions of thefirst and second sources 901 and 903 are multiplied using a multipliercircuit 911. In some embodiments, the signed packed data elements of thefirst source 901 are sign extended and the unsigned packed data elementsof the second source 903 are zero extended prior to the multiplications.

In some embodiments, these multiplier circuits 905-911 are reused forother packed data elements positions. In other embodiments, additionalmultiplier circuits are used so that the packed data elements areprocessed in parallel. In some contexts, parallel execution is doneusing lanes that are the size of the signed third source 915. Theresults of each of the multiplications are added using additioncircuitry 913.

The result of the addition of the results of the multiplications isadded to the data from most significant packed data element position ofthe signed source 3 915 (using a different adder 917 or the same adder913).

Finally, the result 919 of the second addition is either stored into thesigned destination in a packed data element position that corresponds tothe packed data element position used from the signed third source 915or passed to the next iteration. In some embodiments, a writemask isapplied to this storage such that if a corresponding writemask (bit) isset, the storage happens, and, if not set, the storage does not happen.

FIG. 10 illustrates an embodiment of a subset of the execution of aniteration of chained fused multiply accumulate instruction. Inparticular, this illustrates execution circuitry of an iteration of onepacked data element position of the destination. In this embodiment, thechained fused multiply accumulate is operating on a signed source and anunsigned source wherein the accumulator is 4× the input data size.

A first signed source 1001 and a second unsigned source 1003 each havefour packed data elements. Each of these packed data elements storesdata such as floating point or integer data. A third signed source 1015(initial or previous result) has a packed data element of which storessigned data. The sizes of the first and second sources are a quarter ofthe third signed source 1015 (initial or previous result). For example,the first and second sources could have 16-bit packed data elements(e.g., word) and the third signed source 1015 (initial or previousresult) could have 64-bit packed data elements (e.g., double precisionfloating point or 64-bit integer).

In this illustration, the four most significant packed data elementpositions of the first signed source 1001 and the second unsigned source1003 and the most significant packed data element position of the thirdsigned source 1015 are shown. Of course, other packed data elementpositions would also be processed if there are any.

As illustrated, packed data elements are processed in quadruplets. Forexample, the data of the most significant packed data element positionsof the first signed source 1001 and the second unsigned source 1003 aremultiplied using a multiplier circuit 1005, data from second mostsignificant packed data element positions of the first signed source1001 and the second unsigned source 1003 are multiplied using amultiplier circuit 1007, data from third most significant packed dataelement positions of the first signed source 1001 and the secondunsigned source 1003 are multiplied using a multiplier circuit 1009, anddata from the least significant packed data element positions of thefirst signed source 1001 and the second unsigned source 1003 aremultiplied using a multiplier circuit 1011. In some embodiments, thesigned packed data elements of the first signed source 1001 are signextended and the unsigned packed data elements of the second unsignedsource 1003 are zero extended prior to the multiplications.

In some embodiments, these multiplier circuits 1005-1011 are reused forother packed data elements positions. In other embodiments, additionalmultiplier circuits are used so that the packed data elements areprocessed in parallel. In some contexts, parallel execution is doneusing lanes that are the size of third signed source 1015 (initial orprevious result). The result of the addition of the results of themultiplications is added to the data from most significant packed dataelement position of third signed source 1015 (initial or previousresult) using adder/saturation 1013 circuitry.

Addition/saturation (accumulator) circuitry 1013 preserves a sign of anoperand when the addition results in a value that is too big or toosmall for signed saturation. In particular, saturation evaluation occurson the infinite precision result between the multi-way-add and the writeto the destination. When the accumulator 1013 is floating point and theinput terms are integer, the sum of products and the floating-pointaccumulator input value are turned into infinite precision values (fixedpoint numbers of hundreds of bits), the addition of the multiplicationresults and the third input is performed, and a single rounding to theactual accumulator type is performed.

The result 1019 of the addition and saturation check is stored into thesigned destination in a packed data element position that corresponds tothe packed data element position used from third signed source 1015(initial or previous result) or passed to the next iteration. In someembodiments, a writemask is applied to this storage such that if acorresponding writemask (bit) is set, the storage happens, and, if notset, the storage does not happen.

FIG. 11 illustrates power-of-two sized SIMD implementations wherein theaccumulators use input sizes that are larger than the inputs to themultipliers according to an embodiment. Note the source (to themultipliers) and accumulator values may be signed or unsigned values.For an accumulator having 2× input sizes (in other words, theaccumulator input value is twice the size of the packed data elementsizes of the sources), table 1101 illustrates different configurations.For byte sized sources, the accumulator uses word or half-precisionfloating-point (HPFP) values that are 16-bit in size. For word sizedsources, the accumulator uses 32-bit integer or single-precisionfloating-point (SPFP) values that are 32-bit in size. For SPFP or 32-bitinteger sized sources, the accumulator uses 64-intenger ordouble-precision floating-point (DPFP) values that are 64-bit in size.

For an accumulator having 4× input sizes (in other words, theaccumulator input value is four times the size of the packed dataelement sizes of the sources), table 1103 illustrates differentconfigurations. For byte sized sources, the accumulator uses 32-bitinteger or single-precision floating-point (SPFP) values that are 32-bitin size. For word sized sources, the accumulator uses 64-bit integer ordouble-precision floating-point (DPFP) values that are 64-bit in size insome embodiments.

For an accumulator having 8× input sizes (in other words, theaccumulator input value is eight times the size of the packed dataelement sizes of the sources), table 1105 illustrates a configuration.For byte sized sources, the accumulator uses 64-bit integer.

As hinted at earlier, matrix operations circuitry may be included in acore, or as an external accelerator. FIG. 12 illustrates an embodimentof a system utilizing matrix operations circuitry. In this illustration,multiple entities are coupled with a ring interconnect 1245.

A plurality of cores, core 0 1201, core 1 1203, core 2 1205, and core N1207 provide non-tile-based instruction support. In some embodiments,matrix operations circuitry 1251 is provided in a core 1203, and inother embodiments matrix operations circuitry 1211 and 1213 areaccessible on the ring interconnect 1245.

Additionally, one or more memory controllers 1223-1225 are provided tocommunicate with memory 1233 and 1231 on behalf of the cores and/ormatrix operations circuitry.

FIG. 13 illustrates an embodiment of a processor core pipelinesupporting matrix operations using tiles. Branch prediction and decodecircuitry 1303 performs branch predicting of instructions, decoding ofinstructions, and/or both from instructions stored in instructionstorage 1301. For example, instructions detailed herein may be stored ininstruction storage. In some implementations, separate circuitry is usedfor branch prediction and in some embodiments, at least someinstructions are decoded into one or more micro-operations, micro-codeentry points, microinstructions, other instructions, or other controlsignals using microcode 1305. The branch prediction and decode circuitry1303 may be implemented using various different mechanisms. Examples ofsuitable mechanisms include, but are not limited to, look-up tables,hardware implementations, programmable logic arrays (PLAs), microcoderead only memories (ROMs), etc.

The branch prediction and decode circuitry 1303 is coupled toallocate/rename 1307 circuitry which is coupled, in some embodiments, toscheduler circuitry 1309. In some embodiments, these circuits provideregister renaming, register allocation, and/or scheduling functionalityby performing one or more of: 1) renaming logical operand values tophysical operand values (e.g., a register alias table in someembodiments), 2) allocating status bits and flags to the decodedinstruction, and 3) scheduling the decoded instruction for execution onexecution circuitry out of an instruction pool (e.g., using areservation station in some embodiments).

The scheduler circuitry 1309 represents any number of differentschedulers, including reservations stations, central instruction window,etc. The scheduler circuitry 1309 is coupled to, or includes, physicalregister file(s) 1315. Each of the physical register file(s) 1315represents one or more physical register files, different ones of whichstore one or more different data types, such as scalar integer, scalarfloating point, packed integer, packed floating point, vector integer,vector floating point, status (e.g., an instruction pointer that is theaddress of the next instruction to be executed), tiles, etc. In oneembodiment, the physical register file(s) 1315 comprises vectorregisters circuitry, write mask registers circuitry, and scalarregisters circuitry. These register circuits may provide architecturalvector registers, vector mask registers, and general-purpose registers.The physical register file(s) 1315 is overlapped by a retirement circuit1317 to illustrate various ways in which register renaming andout-of-order execution may be implemented (e.g., using a reorderbuffer(s) and a retirement register file(s); using a future file(s), ahistory buffer(s), and a retirement register file(s); using a registermaps and a pool of registers; etc.). The retirement circuit 1317 and thephysical register file(s) 1315 are coupled to the execution circuitry1311.

While register renaming is described in the context of out-of-orderexecution, it should be understood that register renaming may be used inan in-order architecture. While the illustrated embodiment of theprocessor may also include separate instruction and data cache units anda shared L2 cache unit, alternative embodiments may have a singleinternal cache for both instructions and data, such as, for example, aLevel 1 (L1) internal cache, or multiple levels of internal cache. Insome embodiments, the system may include a combination of an internalcache and an external cache that is external to the core and/or theprocessor. Alternatively, all of the cache may be external to the coreand/or the processor.

The execution circuitry 1311 is a set of one or more execution circuits,including scalar circuitry 1321, vector/SIMD circuitry 1323, and matrixoperations circuitry 1327, as well as memory access circuitry 1325 toaccess cache 1313. The execution circuits perform various operations(e.g., shifts, addition, subtraction, multiplication) and on varioustypes of data (e.g., scalar floating point, packed integer, packedfloating point, vector integer, vector floating point). While someembodiments may include a number of execution units dedicated tospecific functions or sets of functions, other embodiments may includeonly one execution unit or multiple execution units that all perform allfunctions. The scalar circuitry 1321 performs scalar operations, thevector/SIMD circuitry 1323 performs vector/SIMD operations, and matrixoperations circuitry 1327 performs matrix (tile) operations detailedherein.

By way of example, the exemplary register renaming, out-of-orderissue/execution core architecture may implement a pipeline asfollows: 1) an instruction fetch circuit performs fetch and lengthdecoding stages; 2) the branch and decode circuitry 1303 performs adecode stage; 3) the allocate/rename 1307 circuitry performs anallocation stage and renaming stage; 4) the scheduler circuitry 1309performs a schedule stage; 5) physical register file(s) (coupled to, orincluded in, the scheduler circuitry 1309 and allocate/rename 1307circuitry and a memory unit perform a register read/memory read stage;the execution circuitry 1311 performs an execute stage; 6) a memory unitand the physical register file(s) unit(s) perform a write back/memorywrite stage; 7) various units may be involved in the exception handlingstage; and 8) a retirement unit and the physical register file(s)unit(s) perform a commit stage.

The core may support one or more instructions sets (e.g., the x86instruction set (with some extensions that have been added with newerversions); the MIPS instruction set of MIPS Technologies of Sunnyvale,Calif.; the ARM instruction set (with optional additional extensionssuch as NEON) of ARM Holdings of Sunnyvale, Calif.), including theinstruction(s) described herein. In one embodiment, the core 1390includes logic to support a packed data instruction set extension (e.g.,AVX1, AVX2), thereby allowing the operations used by many multimediaapplications to be performed using packed data.

It should be understood that the core may support multithreading(executing two or more parallel sets of operations or threads), and maydo so in a variety of ways including time sliced multithreading,simultaneous multithreading (where a single physical core provides alogical core for each of the threads that physical core issimultaneously multithreading), or a combination thereof (e.g., timesliced fetching and decoding and simultaneous multithreading thereaftersuch as in the Intel® Hyperthreading technology).

FIG. 14 illustrates an embodiment of a processor core pipelinesupporting matrix operations using tiles. Branch prediction and decodecircuitry 1403 performs branch predicting of instructions, decoding ofinstructions, and/or both from instructions stored in instructionstorage 1401. For example, instructions detailed herein may be stored ininstruction storage. In some implementations, separate circuitry is usedfor branch prediction and in some embodiments, at least someinstructions are decoded into one or more micro-operations, micro-codeentry points, microinstructions, other instructions, or other controlsignals using microcode 1405. The branch prediction and decode circuitry1403 may be implemented using various different mechanisms. Examples ofsuitable mechanisms include, but are not limited to, look-up tables,hardware implementations, programmable logic arrays (PLAs), microcoderead only memories (ROMs), etc.

The branch prediction and decode circuitry 1403 is coupled toallocate/rename 1407 circuitry which is coupled, in some embodiments, toscheduler circuitry 1409. In some embodiments, these circuits provideregister renaming, register allocation, and/or scheduling functionalityby performing one or more of: 1) renaming logical operand values tophysical operand values (e.g., a register alias table in someembodiments), 2) allocating status bits and flags to the decodedinstruction, and 3) scheduling the decoded instruction for execution onexecution circuitry out of an instruction pool (e.g., using areservation station in some embodiments).

The scheduler circuitry 1409 represents any number of differentschedulers, including reservations stations, central instruction window,etc. The scheduler unit(s) scheduler circuitry 1409 is coupled to, orincludes, physical register file(s) 1415. Each of the physical registerfile(s) 1415 represents one or more physical register files, differentones of which store one or more different data types, such as scalarinteger, scalar floating point, packed integer, packed floating point,vector integer, vector floating point, status (e.g., an instructionpointer that is the address of the next instruction to be executed),tiles, etc. In one embodiment, the physical register file(s) 1415comprises vector registers circuitry, write mask registers circuitry,and scalar registers circuitry. These register circuits may providearchitectural vector registers, vector mask registers, andgeneral-purpose registers. The physical register file(s) 1415 isoverlapped by a retirement circuit 1417 to illustrate various ways inwhich register renaming and out-of-order execution may be implemented(e.g., using a reorder buffer(s) and a retirement register file(s);using a future file(s), a history buffer(s), and a retirement registerfile(s); using a register maps and a pool of registers; etc.). Theretirement circuit 1417 and the physical register file(s) 1415 arecoupled to the execution circuitry 1411.

While register renaming is described in the context of out-of-orderexecution, it should be understood that register renaming may be used inan in-order architecture. While the illustrated embodiment of theprocessor may also include separate instruction and data cache units anda shared L2 cache unit, alternative embodiments may have a singleinternal cache for both instructions and data, such as, for example, aLevel 1 (L1) internal cache, or multiple levels of internal cache. Insome embodiments, the system may include a combination of an internalcache and an external cache that is external to the core and/or theprocessor. Alternatively, all of the cache may be external to the coreand/or the processor.

The execution circuitry 1411 a set of one or more execution circuits1427 and a set of one or more memory access circuits 1425 to accesscache 1413. The execution circuits 1427 perform matrix (tile) operationsdetailed herein.

By way of example, the exemplary register renaming, out-of-orderissue/execution core architecture may implement a pipeline asfollows: 1) an instruction fetch circuit performs fetch and lengthdecoding stages; 2) the branch and decode circuitry 1403 performs adecode stage; 3) the allocate/rename 1407 circuitry performs anallocation stage and renaming stage; 4) the scheduler circuitry 1409performs a schedule stage; 5) physical register file(s) (coupled to, orincluded in, the scheduler circuitry 1409 and allocate/rename 1407circuitry and a memory unit perform a register read/memory read stage;the execution circuitry 1411 performs an execute stage; 6) a memory unitand the physical register file(s) unit(s) perform a write back/memorywrite stage; 7) various units may be involved in the exception handlingstage; and 8) a retirement unit and the physical register file(s)unit(s) perform a commit stage.

The core may support one or more instructions sets (e.g., the x86instruction set (with some extensions that have been added with newerversions); the MIPS instruction set of MIPS Technologies of Sunnyvale,Calif.; the ARM instruction set (with optional additional extensionssuch as NEON) of ARM Holdings of Sunnyvale, Calif.), including theinstruction(s) described herein. In one embodiment, the core 1490includes logic to support a packed data instruction set extension (e.g.,AVX1, AVX2), thereby allowing the operations used by many multimediaapplications to be performed using packed data.

It should be understood that the core may support multithreading(executing two or more parallel sets of operations or threads), and maydo so in a variety of ways including time sliced multithreading,simultaneous multithreading (where a single physical core provides alogical core for each of the threads that physical core issimultaneously multithreading), or a combination thereof (e.g., timesliced fetching and decoding and simultaneous multithreading thereaftersuch as in the Intel® Hyperthreading technology).

Layout

Throughout this description, data is expressed using row major datalayout. Column major users should translate the terms according to theirorientation. FIG. 15 illustrates an example of a matrix expressed in rowmajor format and column major format. As shown, matrix A is a 2×3matrix. When this matrix is stored in row major format, the dataelements of a row are consecutive. When this matrix is stored in columnmajor format, the data elements of a column are consecutive. It is awell-known property of matrices that A^(T)*B^(T)=(BA)^(T), wheresuperscript T means transpose. Reading column major data as row majordata results in the matrix looking like the transpose matrix.

In some embodiments, row-major semantics are utilized in hardware, andcolumn major data is to swap the operand order with the result beingtransposes of matrix, but for subsequent column-major reads from memoryit is the correct, non-transposed matrix.

For example, if there are two column-major matrices to multiply:

$\begin{matrix}{a\mspace{11mu} b} & {g\mspace{11mu} i\mspace{11mu} k} & {{ag} + {{bh}\mspace{11mu}{ai}} + {{bj}\mspace{11mu}{ak}} + {bl}} \\{c\mspace{11mu} d^{*}} & {{h\; j\mspace{11mu} l} =} & {{cg} + {{dh}\mspace{11mu}{ci}} + {{dj}\mspace{11mu}{ck}} + {dl}} \\{e\; f} & \; & {{eg} + {{fh}\mspace{11mu}{ei}} + {{fj}\mspace{11mu}{ek}} + {fl}} \\\left( {3 \times 2} \right) & \left( {2 \times 3} \right) & \left( {3 \times 3} \right)\end{matrix}$

The input matrices would be stored in linear memory (column-major) as:

-   -   acebdf    -   and    -   ghijkl.

Reading those matrices as row-major with dimensions 2×3 and 3×2, theywould appear as:

$\begin{matrix}{a\mspace{14mu} c\mspace{14mu} e} & {and} & {g\mspace{14mu} h} \\{b\mspace{14mu} d\mspace{11mu} f} & \; & {i\mspace{14mu} j} \\{k\mspace{14mu} l} & \; & \;\end{matrix}$

Swapping the order and matrix multiplying:

$\begin{matrix}{g\mspace{11mu} h} & {a\mspace{11mu} c\mspace{11mu} e} & {{ag} + {{bh}\mspace{11mu}{cg}} + {{dh}\mspace{11mu}{eg}} + {fh}} \\{i\; j*} & {{b\mspace{11mu} d\; f} =} & {{ai} + {{bj}\mspace{11mu}{ci}} + {{dj}\mspace{11mu}{ei}} + {fj}} \\{k\mspace{11mu} l} & \; & {{ak} + {{bl}\mspace{11mu}{ck}} + {{dl}\mspace{11mu}{ek}} + {fl}}\end{matrix}$

the transpose matrix is out and can then be stored in in row-majororder:

-   -   ag+bh cg+dh eg+fh ai+bj ci+dj ei+fj ak+bl ck+dl ek+fl

and used in subsequent column major computations, it is the correctun-transposed matrix:

$\begin{matrix}{{ag} + {bh}} & {{ai} + {bj}} & {{ak} + {bl}} \\{{cg} + {dh}} & {{ci} + {dj}} & {{ck} + {dl}} \\{{eg} + {fh}} & {{ei} + {fj}} & {{ek} + {fl}}\end{matrix}$

Exemplary Usage

FIG. 16 illustrates an example of usage of matrices (tiles). In thisexample, matrix C 1601 includes two tiles, matrix A 1603 includes onetile, and matrix B 1605 includes two tiles. This figure shows an exampleof the inner loop of an algorithm to compute a matrix multiplication. Inthis example, two result tiles, tmm0 and tmm1, from matrix C 1601 areused to accumulate the intermediate results. One tile from the matrix A1603 (tmm2) is re-used twice as it multiplied by two tiles from matrix B1605. Pointers to load a new A matrix (tile) and two new B matrices(tiles) from the directions indicated by the arrows. An outer loop, notshown, adjusts the pointers for the C tiles.

The exemplary code as shown includes the usage of a tile configurationinstruction and is executed to configure tile usage, load tiles, a loopto process the tiles, store tiles to memory, and release tile usage.

FIG. 17 illustrates an embodiment of usage of matrices (tiles). At 1701,tile usage is configured. For example, a TILECONFIG instruction isexecuted to configure tile usage including setting a number of rows andcolumns per tile. Typically, at least one matrix (tile) is loaded frommemory at 1703. At least one matrix (tile) operation is performed at1705 using the matrices (tiles). At 1707, at least one matrix (tile) isstored out to memory and a context switch can occur at 1709.

Exemplary Configuration Tile Configuration Hardware Support

As discussed above, tile usage typically needs to be configured prior touse. For example, full usage of all rows and columns may not be needed.Not only does not configuring these rows and columns save power in someembodiments, but the configuration may be used to determine if anoperation will generate an error. For example, a matrix multiplicationof the form (N×M)*(L×N) will typically not work if M and L are not thesame.

Prior to using matrices using tiles, in some embodiments, tile supportis to be configured. For example, how many rows and columns per tile,tiles that are to be used, etc. are configured. A TILECONFIG instructionis an improvement to a computer itself as it provides for support toconfigure the computer to use a matrix accelerator (either as a part ofa processor core, or as an external device). In particular, an executionof the TILECONFIG instruction causes a configuration to be retrievedfrom memory and applied to matrix (tile) settings within a matrixaccelerator.

Tile Usage Configuration

FIG. 18 illustrates support for configuration of the usage of tilesaccording to an embodiment. A memory 1801 contains the tile description1803 of the matrices (tiles) to be supported.

Instruction execution resources 1811 of a processor/core 1805 storesaspects of a tile description 1803 into tile configurations 1817. Thetile configurations 1817 include palette table 1813 to detail what tilesfor a palette are configured (the number of rows and columns in eachtile) and a marking that matrix support is in use. In particular,instruction execution resources 1811 are configured to use tiles asspecified by the tile configurations 1817. The instruction executionresources 1811 may also include a machine specific register orconfiguration register to indicate tile usage. Additional values such asin-use and start values are also set. The tile configurations 1817utilize register(s) 1819 to store tile usage and configurationinformation.

FIG. 19 illustrates an embodiment of a description of the matrices(tiles) to be supported. This is the description that is to be storedupon an execution of a STTILECFG instruction. In this example, eachfield is a byte. In byte [0], a palette ID 1901 is stored. The paletteID is used to index a palette table 1813 which stores, per palette ID, anumber of bytes in a tile, and bytes per row of the tiles that areassociated with this ID as defined by the configuration.

Byte 1 stores a value to be stored in a “startRow” register 1903 andbyte 2 stores a value to be stored in a register, startP 1905. Tosupport restarting instructions after these events, the instructionsstore information these registers. To support restarting instructionsafter break events such as those detailed above, the instructions storeinformation in these registers. The startRow value indicates the rowthat should be used for restart. The startP value indicates the positionwithin the row for store operations when pairs are used and, in someembodiments, indicates the lower half of the row (in the lower tile of apair) or higher half of the row (in the higher tile of a pair).Generally, the position in the row (the column) is not needed.

With the exception of TILECONFIG and STTILECFG, successfully executingmatrix (tile) instructions will set both startRow and startP to zero.

Any time an interrupted matrix (tile) instruction is not restarted, itis the responsibility of software to zero the startRow and startPvalues. For example, unmasked floating point exception handlers mightdecide to finish the operation in software and change the programcounter value to another instruction, usually the next instruction. Inthis case the software exception handler must zero the startRow andstartP values in the exception presented to it by the operating systembefore resuming the program. The operating system will subsequentlyreload those values using a restore instruction.

Byte 3 stores an indication of pairs (1 b per tile) of tiles 1907.

Bytes 16-17 store the number of rows 1913 and columns 1915 for tile 0,bytes 18-19 store the number of rows and columns for tile 1, etc. Inother words, each 2-byte group specifies a number of rows and columnsfor a tile. If a group of 2 bytes is not used to specify tileparameters, they should have the value zero. Specifying tile parametersfor more tiles than the implementation limit or the palette limitresults in a fault. Unconfigured tiles are set to an initial state with0 rows, 0 columns.

Finally, the configuration in memory typically ends with an endingdelineation such as all zeros for several consecutive bytes.

Exemplary Tile and Tile Configuration Storage

FIGS. 20(A)-(D) illustrate examples of register(s) 1819. FIG. 20(A)illustrates a plurality of registers 1819. As shown each tile (TMM0 2001. . . TMMN 2003) has a separate register with each register storing arow and column size for that particular tile. StartP 2011 and StartRow2013 are stored in separate registers. One or more status registers 2015are set (e.g., TILES_CONFIGURED=1) to indicate tiles are configured foruse.

FIG. 20(B) illustrates a plurality of registers 1819. As shown each tilehas separate registers for its rows and columns. For example, TMM0 rowsconfiguration 2021, TMM0 columns configuration 2023, StartP 2011 andStartRow 2013 are stored in separate registers. One or more statusregisters 2015 are set (e.g., TILES_CONFIGURED=1) to indicate tiles areconfigured for use.

FIG. 20(C) illustrates a single register 1819. As shown, this registerstores tile configurations (rows and columns per tile) 2031, StartP2011, and StartRow 2013 are stored in single register as packed dataregisters. One or more status registers 2015 are set (e.g.,TILES_CONFIGURED=1) to indicate tiles are configured for use.

FIG. 20(D) illustrates a plurality of registers 1819. As shown, a singleregister stores tile configuration (rows and columns per tile) 2031.StartP and StartRow are stored in separate registers 2011 and 2013. Oneor more status registers 2015 are set (e.g., TILES_CONFIGURED=1) toindicate tiles are configured for use.

Other combinations are contemplated such as combining the startregisters into a single register where they are shown separately, etc.

TileMoveTo1D/TileMoveFrom1D

Disclosed embodiments describe instructions for performing direct movesof elements between 2-dimensional (2D) matrices and 1-dimensional (1D)vector registers. Disclosed embodiments describe instructions, sometimesreferred to as TileMoveTo1D and TileMoveFrom1D instructions, forarranging groups of elements from a matrix into one dimension, therebyimproving matrix operations by leveraging useful execution hardwaretargeted for the classic 1D vector operation.

Disclosed embodiments describe processing instructions, namelyTileMoveTo1D and TileMoveFrom1D, to directly move rows or columns (oreven sub-rows, sub-columns, or rectangular submatrices) between tileregisters and vector registers. Also disclosed are optimizations to thebehavior of the TileMoveTo1D instruction, including, for example, “lazy”moving of actual data or possibly not moving it at all but justutilizing it from within the tile registers.

Without the benefits of the disclosed TileMoveTo1D and TileMoveFrom1D,if one wishes to leverage the versatile execution hardware available for1D vector operations, moving a group of elements from a matrix (tile) toa vector register would require loading the matrix (tile) from memoryinto the core, arranging the elements of interest into a singledimension, then storing the modified matrix (tile) back to memory for itto be used. Such a process of storing a matrix (tile) and loading itback is quite slow and requires moving the whole tile of data back andforth. This increases latency of operations as well as consumes storagein the cache, which reduces efficiency of the cache bandwidth usage.

As will be further illustrated and described below, at least withrespect to FIGS. 21-24, the disclosed embodiments describe a pluralityof instructions to enable efficient movement of data between the2-dimensional matrices (tiles) and traditional 1-dimensional vectorregisters.

As disclosed embodiments of TileMoveTo1D and TileMoveFrom1D instructionsmove the data directly, algorithms which require operations to beperformed within the versatile vector execution hardware can be donewith much lower latency. Disclosed embodiments reduce the latency owedto usage of memory in other approaches. As an added bonus, the directmoving of data between the vectors and the matrices (tiles), withoutusing the cache and memory as an intermediary, is expected to improvecache and memory efficiency, which will be noticeable for largerworkloads.

Configurable Groups of Matrix Elements to Move From or To

The disclosed instructions reference data based on elements anddatatypes logically stored in these different registers and furtherhandle the two-dimensionality by allowing flexible choice of groups ofelements to move. Disclosed embodiments allow the TileMoveTo1D andTileMoveFrom1D instructions to specify particular groups of elements tomove, including at least any of the following:

-   -   One or more matrix rows or columns moved to vector registers,    -   Vector registers moved to one or more matrix rows or columns.    -   A rectangular sub-matrix of elements moved to vector registers,        and    -   Matrix elements moved to a single vector-register or multiple        vector-registers.

A format of the disclosed TileMoveTo1D and TileMoveFrom1D instructions,including how to specify a group of elements to be moved, is furtherillustrated and described with respect to FIGS. 24, 25A-D, and 26A-C.

Configurable Groups to Process

As described above, disclosed embodiments perform the TileMoveTo1D orTileMoveFrom1D instructions on groups of elements within a specifiedmatrix (tile), either loading the group of elements in the specifiedmatrix from vector registers or storing the group of elements from thespecified matrix (tile) to vector registers. A group of elements mayconsist of all elements within a matrix (tile), or a matrix (tile) maybe partitioned row-wise, column-wise, or into sub-tiles. Otherpartitions are possible, but not described for sake of simplicity.

Group: Entire Matrix (Tile)

In some embodiments, a group of elements in a matrix is specified by aTileMoveTo1D or TileMoveFrom1D instruction, and the group consists ofthe entire matrix (tile); i.e., every element of the specified matrix(tile) is involved. In such embodiments, in the case of a TileMoveFrom1Dinstruction, the entire specified matrix is loaded from specified sourcevector registers, and, in the case of a TileMoveTo1D instruction, theentire specified matrix is stored into the specified destination vectorregisters. The format of TileMoveTo1D or TileMoveFrom1D instructions isfurther illustrated and described with respect to FIGS. 24-26.

Group: Row(s)

In some embodiments, TileMoveTo1D or TileMoveFrom1D instructions specifyone or more rows of elements within a matrix (tile). In some suchembodiments, one row of elements, be they crumb-sized (2 bits, a.k.a.dibit, tayste, lyck), nibble-sized, byte-sized, word-sized,doubleword-sized, or quadword-sized, is processed in parallel.Sometimes, multiple rows of the specified matrix (tile) make up eachgroup, and that number of rows is specified by the TileMoveTo1D orTileMoveFrom1D instruction or is pre-configured in aconfiguration/status register (e.g., XTILECONFIG). In some embodiments,the makeup of each group is specified by the instruction. In someembodiments, the TileMoveTo1D or TileMoveFrom1D instruction specifies agroup of elements consisting of a sub-row of elements. The format ofTileMoveTo1D or TileMoveFrom1D instructions is further illustrated anddescribed with respect to FIGS. 24-26.

Group: Column(s)

Some disclosed embodiments process a TileMoveTo1D or TileMoveFrom1Dinstruction specifying one or more columns of elements within a matrix(tile). In some such embodiments, one column of elements, be theynibble-sized, byte-sized, word-sized, doubleword-sized, orquadword-sized, is processed in parallel. Sometimes, multiple columns ofthe specified matrix (tile) make up each group, while at other timesless than all of the elements of a column of the specified matrix (tile)make up the group, and that number of columns is specified by theTileMoveTo1D or TileMoveFrom1D instruction or is pre-configured in aconfiguration/status register (e.g., XTILECONFIG). In some embodiments,the size of each group is specified by the instruction. The format ofTileMoveTo1D or TileMoveFrom1D instructions is further illustrated anddescribed with respect to FIGS. 24-26.

Group: Sub-Tile

Some embodiments process a TileMoveTo1D or TileMoveFrom1D instructionspecifying sub-matrices (sub-tiles) as groups of elements within amatrix (tile). For example, in some embodiments, the specified matrix(tile), having M rows by N columns, is partitioned into a plurality ofequal-sized sub-tiles consisting of O rows by P columns, wherein M is aninteger multiple of O and N is an integer multiple of P. In some suchembodiments, one submatrix (sub-tile) group of elements, be theycrumb-sized (2 bits; a.k.a. dibit, tayste, lyck) byte-sized, word-sized,doubleword-sized, quadword-sized, or any other configured partition, isprocessed in parallel. In some embodiments, the TileMoveTo1D orTileMoveFrom1D instruction specifies the size of a sub-tile on which tooperate. In other embodiments, the size of the sub-tile is specified bythe TileMoveTo1D or TileMoveFrom1D instruction or is pre-configured in aconfiguration/status register (e.g., XTILECONFIG). In some embodiments,the size of each group is specified by the instruction. The format ofTileMoveTo1D or TileMoveFrom1D instructions is further illustrated anddescribed with respect to FIGS. 24-26.

Configurable Data Formats and Sizes

The format of the disclosed TileMoveTo1D and TileMoveFrom1D instructionsfurther supports various element data formats and sizes, including:multiple variations of floating-point formats, includingdouble-precision (64-bits), single-precision (32-bits), andhalf-precision (16-bits), and multiple integer formants, including64-bit, 32-bit, 16-bit and 8-bit integer formats. Even smaller dataformats, like 4-bit nibbles or 2-bit crumbs, are supported by thedisclosed TileMoveTo1D and TileMoveFrom1D instructions. A format of thedisclosed TileMoveTo1D and TileMoveFrom1D instructions, including how tospecify a group of elements to be moved, is further illustrated anddescribed with respect to FIGS. 24, 25A-D, and 26A-C.

In some embodiments, the size of the rows or columns fits the width orheight of the vector registers. For example, a row may have 16, 32-bitelements which would match the width of a 512-bit vector register. Butthese instructions could also have variants where a row or column wouldbe split across multiple vector register or where two or morerows/columns could fit in a single vector register.

TileMoveTo1D and TileMoveFrom1D Instruction Variations

Lazy Move—In some embodiments, rather than moving the data in actualityat the time of the move operation, the processor just records the factthat the architectural values for that register are now in a differentlocation (a row in a tile register, for example). Then the processorreads that row when a vector operation consumes that value as a source.In some embodiments, after that first vector operation, the result wouldbe placed in the normal vector register file. The move back into thetile row could be done in a similar lazy way or it could actually movethe data at the time of the move.

Second register file—In some embodiments, the 2-dimensional (tile)register file could allow the rows or columns to be accessed similarlyto the regular vector register file and as such just operate from the2-dimensional register file. In contrast to the Lazy Move option above,in this option the data would never move to the vector register file butjust continue to use the tile register file as storage for thearchitectural vector register.

Row or Column Addressable—A possible mechanism for an instruction thatwould move specific rows or columns of a particular tile register to bespecified directly in a move instruction. For example, a TileMoveTo1Dinstruction tile register TMM0.row3 to vector register ZMM0. The samewould work for moving a vector register ZMM1 to a TMM0.col4.

Vector Execution Units for Elementwise Tile Operations—in someembodiments, basic, element-wise, arithmetic operations are performed onelements being moved. Such operations can be performed using executionhardware that is shared with the traditional 1D vector operations. Insome embodiments, element-wise operations leverage traditional 1D vectorexecution units to cycle through rows or columns (possibly multiple percycle) to execute such element-wise operations. If the 1D vectorexecution units are located near the tile register file, leveragingthese to implement some basic operations is very space efficient.

There may also be multiple groups of elements in a matrix (tile). Insome embodiments, matrices (tiles) contain multiple, equal-sized groupsof elements. For example, in some embodiments, each of the source M by Nmatrices (tiles) specified by the TileMoveTo1D or TileMoveFrom1Dinstruction comprises M equal-sized groups of elements, each group ofelements comprising every element in a corresponding row of the matrix.In some embodiments, each of the source M by N matrices (tiles)specified by the TileMoveTo1D or TileMoveFrom1D instruction comprises Nequal-sized groups of elements, each group of elements comprising everyelement in a corresponding column of the matrix.

In other embodiments, each of the source M by N matrices (tiles)specified by the TileMoveTo1D or TileMoveFrom1D instruction comprises anO by P submatrix (sub-tile), wherein M is an integer multiple of O and Nis an integer multiple of P. For example, a 256×256 source matrix (tile)could be processed as one 16×16 submatrix (sub-tile) at a time.

In yet other embodiments, each of the source M by N matrices (tiles)specified by the TileMoveTo1D or TileMoveFrom1D instruction comprisesgroups of elements whose total width equals a width of a parallelexecution datapath of the execution circuitry. For example, in anembodiment, a processor has a 64-bit parallel execution datapath, andthe specified source matrices are processed in groups each having atotal width of 64 bits.

Processing of TileMoveTo1D or TileMoveFrom1D instructions according tosome embodiments is illustrated and described with respect to FIGS.21-23. A format of the TileMoveTo1D or TileMoveFrom1D instructionsaccording to disclosed embodiments is further illustrated and describedwith respect to FIGS. 24-26D. Processors having execution circuitry toprocess TileMoveTo1D or TileMoveFrom1D instructions are furtherillustrated and described with respect to FIGS. 28-31. Computing systemsfor processing TileMoveTo1D or TileMoveFrom1D instructions are furtherillustrated and described with respect to FIGS. 32-35.

Exemplary Execution

FIG. 21 illustrates an exemplary execution of a TileMoveTo1D instructionaccording to some embodiments. As shown, TileMoveTo1D instruction 2100includes fields to specify an opcode 2102 (e.g., TileMoveTo1D), adestination location 2104, a source location 2106 and a group select2108 (e.g., to specify one of a sub-matrix, a row, a column, a sub-row,and a sub-column). In the case of a TileMoveTo1D instruction, sourcelocation 2106 is to specify a matrix (tile), while destination location2104 is to specify one or more vector registers. In some embodiments,all elements of the group being moved fit into a single vector register,for example, a group of 32 word-sized elements can be packed into a512-bit vector register. In other embodiments, more than one vectorregister is used. A format of the TileMoveTo1D instruction 2100 isfurther detailed and illustrated with respect to FIGS. 24, 25A-B, and26A-D.

Also shown are four different execution flow block diagrams, eachspecifying a different group of elements to move.

Group: Column of Source Matrix

In a first illustrative embodiment, TileMoveTo1D instruction 2100 isperformed to move a selected column of source 0 2110A to destination 02116A. Execution circuitry 2112A includes arrange circuitry 2113A toline up the potentially rectangular elements of source 0 2110A into asingle dimension. In some embodiments, execution circuitry 2112Aincludes transform circuitry 2114A to transform the source elements, forexample to convert elements having a floating-point format into a lower-or higher-precision floating point format. Some embodiments of executioncircuitry 2112A include operation (OP) circuitry 2115A to perform somearithmetic or logical function on the elements of source 0 2110A as theypass by on their way to destination 0 2116A. For example, OP 2115A mayincrement numerical data that passes by on its way to destination 02116A.

Group: Row of Source Matrix

In a second illustrated example, the TileMoveTo1D instruction 2100 isperformed to move a selected row of source 1 2110B to destination 12116B. Execution circuitry 2112B includes arrange circuitry 2113B toline up the potentially rectangular elements of source 1 2110B into asingle dimension. In some embodiments, execution circuitry 2112Bincludes transform circuitry 2114B to transform the source elements, forexample to convert elements having a floating-point format into a lower-or higher-precision floating point format. Some embodiments of executioncircuitry 2112B include operation (OP) circuitry 2115B to perform somearithmetic or logical function on the elements of source 1 2110B as theypass by on their way to destination 1 2116B. For example, OP 2115B mayincrement numerical data that passes by on its way to destination 12116B.

Group: Multiple Sub-Rows of Source Matrix

In a third illustrated example, the TileMoveTo1D instruction 2100 isperformed to move two selected sub-columns of source 2 2110C todestination 2 2116C. Execution circuitry 2112C includes arrangecircuitry 2113C to line up the potentially rectangular elements ofsource 2 2110C into a single dimension. In some embodiments, executioncircuitry 2112C includes transform circuitry 2114C to transform thesource elements before they reach destination 2 2116C. Some embodimentsof execution circuitry 2112C include operation (OP) circuitry 2115C toperform some arithmetic or logical function on the elements of source 22110C as they pass by on their way to destination 2 2116C.

Group: Sub-Matrix (Sub-Tile) of Source Matrix

In a fourth illustrated example, the TileMoveTo1D instruction 2100 isperformed to move a four-element sub-tile of source 3 2110D todestination 3 2116D. Execution circuitry 2112D includes arrangecircuitry 2113D to line up the potentially rectangular elements ofsource 3 2110D into a single dimension. In some embodiments, executioncircuitry 2112D includes transform circuitry 2114D to transform thesource elements before they reach destination 3 2116D. Some embodimentsof execution circuitry 2112D include operation (OP) circuitry 2115D toperform some arithmetic or logical function on the elements of source 32110D as they pass by on their way to destination 3 2116D.

FIG. 22 illustrates an exemplary execution of a TileMoveFrom1Dinstruction according to some embodiments. As shown, TileMoveFrom1Dinstruction 2200 includes fields to specify an opcode 2202 (e.g.,TileMoveFrom1D), a destination location 2204, a source location 2206 anda group select 2208 (e.g., to specify one of a sub-matrix, a row, acolumn, a sub-row, and a sub-column). In FIG. 22, source location 2206is to specify a vector register, while destination location 2204 is tospecify a matrix (tile). In some embodiments, all elements of the groupbeing moved fit into a single matrix (tile), for example, a group of 32word-sized elements can be moved from a 512-bit vector register to adestination matrix.

Also shown are four different execution flow block diagrams, eachspecifying a different group of elements to move.

Group: Column of Source Matrix

In a first illustrated embodiment, TileMoveFrom1D instruction 2200 isperformed to move the contents of source 0 2210A to a selected column ofdestination matrix (tile) 2216A. Execution circuitry 2212A includearrange circuitry 2213A to line up the source elements for writing tothe destination matrix. In some embodiments, execution circuitry 2212Aincludes transform circuitry 2214A to transform the source elements, forexample to convert elements having a floating-point format into a lower-or higher-precision floating point format. Some embodiments of executioncircuitry 2212A include operation (OP) circuitry 2215A to perform somearithmetic or logical function on the elements of source 0 2210A as theypass by on their way to destination 0 2216A. For example, OP 2215A mayincrement numerical data that passes by on its way to destination 02216A.

Group: Row of Source Matrix

In a second illustrated example, TileMoveFrom1D instruction 2200 isperformed to move the contents of source 1 2210B to a selected row ofdestination 1 2216B. Execution circuitry 2212B includes arrangecircuitry 2213B to line up the source elements for writing to thedestination matrix. In some embodiments, execution circuitry 2212Bincludes transform circuitry 2214B to transform the source elements, forexample to convert elements having a floating-point format into a lower-or higher-precision floating point format. Some embodiments of executioncircuitry 2212B include operation (OP) circuitry 2215B to perform somearithmetic or logical function on the elements of source 1 2210B as theypass by on their way to destination 1 2216B. For example, OP 2215B mayincrement numerical data that passes by on its way to destination 12216B.

Group: Multiple Sub-Rows of Source Matrix

In a third illustrated example, TileMoveFrom1D instruction 2200 isperformed to move the contents of source 2 2210C to multiple selectedsub-rows of destination 2 2216C. Execution circuitry 2212C includesarrange circuitry 2213C to arrange the source elements for writing intothe destination matrix. In some embodiments, execution circuitry 2212Cincludes transform circuitry 2214C to transform the source elementsbefore they reach destination 2 2216C. Some embodiments of executioncircuitry 2212C include operation (OP) circuitry 2215C to perform somearithmetic or logical function on the elements of source 2 2210C as theypass by on their way to destination 2 2216C.

Group: Sub-Matrix (Sub-Tile) of Source Matrix

In a fourth illustrated example, TileMoveFrom1D instruction 2200 isperformed to move the contents of source 3 2210D to a selectedsub-matrix (sub-tile) of destination 3 2216D. Execution circuitry 2212Dincludes arrange circuitry 2213D to arrange the source elements forwriting into the destination matrix. In some embodiments, executioncircuitry 2212D includes transform circuitry 2214D to transform thesource elements before they reach destination 3 2216D. Some embodimentsof execution circuitry 2212D include operation (OP) circuitry 2215D toperform some arithmetic or logical function on the elements of source 32210D as they pass by on their way to destination 3 2216D.

Exemplary Method(S) of Execution

FIG. 23A is a flow diagram illustrating an embodiment of a processorperforming a processor executing a TileMoveTo1D instruction, accordingto some embodiments. As shown, at 2301, the processor is to fetch, usingfetch circuitry, an instruction having fields to specify an opcode,locations of a two-dimensional (2D) matrix and a one-dimensional (1D)vector, and a group of elements comprising one of a row, part of a row,multiple rows, a column, part of a column, multiple columns, and arectangular sub-tile of the specified 2D matrix, the opcode to indicatea move of the specified group from the 2D matrix to the 1D vector. At2303, the processor is to decode, using decode circuitry, the fetchedinstruction. For example, the processor is to use decode circuitry suchas that illustrated and described at least with respect to FIGS. 13, 14,and 28A-B.

In some embodiments, the processor at 2305 is to schedule execution ofthe decoded instruction. At 2307, the processor is to respond, usingexecution circuitry, to the decoded instruction by moving, either inactuality or with a lazy move, the specified group of elements from thespecified 2D matrix to the specified 1D vector. In some embodiments, theprocessor at 2309 is to commit a result of the executed instruction.Operations 2305 and 2309 are optional, as indicated by their dashedborders, insofar as each may occur at a different time, or not at all.

FIG. 23B is a flow diagram illustrating an embodiment of a processorperforming a processor executing a TileMoveFrom1D instruction, accordingto some embodiments. As shown, at 2351 the processor is to fetch, usingfetch circuitry, an instruction having fields to specify an opcode,locations of a two-dimensional (2D) matrix and a one-dimensional (1D)vector, and a group of elements comprising one of a row, part of a row,multiple rows, a column, part of a column, multiple columns, and arectangular sub-tile of the specified 2D matrix, the opcode to indicatea move of the specified group from the 2D matrix to the 1D vector. At2353, the processor is to decode, using decode circuitry, the fetchedinstruction. For example, the processor is to use decode circuitry suchas that illustrated and described at least with respect to FIGS. 13, 14,and 28A-B.

In some embodiments, the processor at 2355 is to Schedule execution ofthe decoded instruction. At 2357, the processor is to Respond, usingexecution circuitry, to the decoded instruction by moving, either inactuality or with a lazy move, the specified group of elements from thespecified 2D matrix to the specified 1D vector. In some embodiments, theprocessor at 2359 is to commit a result of the executed instruction.

Operations 2355 and 2359 are optional, as indicated by their dashedborders, insofar as each may occur at a different time, or not at all.

Exemplary Instruction Format(s)

FIG. 24 is a block diagram illustrating a format of a TileMoveinstruction, according to some embodiments. As shown, TileMoveinstruction 2400 includes fields to specify an opcode 2402, atwo-dimensional (2D) matrix location 2404, group select 2406 (to selectrow(s), column(s), or a sub-tile within the 2D matrix 2404), and aone-dimensional (1D) vector register location 2408. Examples of opcode2402 include TileMoveTo1D* and TileMoveFrom1D*, execution of which areillustrated in FIGS. 21 and 22, respectively.

Group select 2406 can be located in various locations: it could be aprefix or a suffix of opcode, it could be stored as a value in aregister, and it could be specified as part of an immediate (e.g.,00=sub, etc.).

2D matrix location 2404 can specify a matrix (tile) stored in any ofvector registers and tile registers. In some embodiments, the 2D matrixlocation 2404 is a matrix (tile) in memory.

As shown, TileMove Instruction 2400 further includes several additional,optional instruction modifiers, including operation (OP) 2410, M (numberof rows of 2D matrix location 2404) 2412, N (number of columns of 2Dmatrix location 2404) 2414, vector size 2416, and element size 2418. Thevector size 2416 is to specify the bit-width of 1D vector registerspecified by 2408, and can specify any of 64 bits, 128 bits, 256 bits,512 bits, and 1024 bits. The element size 2418 is to specify the elementsize of any of the elements of the specified 2D matrix location 2404 and1D vector register location 2408, and can specify any one of a crumb, anibble, a byte, a word, a doubleword, and a quadword. In someembodiments, element size 2418 specifies even smaller sizes, like 2bits.

In some embodiments, any one or more of instruction modifiers 2410,2412, 2414, 2416, and 2418 are specified using prefixes or suffixes tothe opcode 2402. In some embodiments, one or more of instructionmodifiers 2410, 2412, 2414, 2416, and 2418 are encoded in an immediatefield (not shown) optionally included with the instruction 2400. In someembodiments, one or more of instruction modifiers 2410, 2412, and 2414is specified via a configuration/status register (e.g., XTILECONFIG).

Opcode 2402 is shown including an asterisk, which is to convey thatadditional prefixes and/or suffixes may be added to specify instructionbehavior. One or more of instruction modifiers 2412, 2414, 2416, and2418, may be specified using prefixes or suffixes to opcode 2402.

Detailed Exemplary Systems, Processors, and Emulation

Detailed herein are examples of hardware, software, etc. to execute theabove described instructions. For example, what is described belowdetails aspects of instruction execution including various pipelinestages such as fetch, decode, schedule, execute, retire, etc.

Instruction Sets

An instruction set may include one or more instruction formats. A giveninstruction format may define various fields (e.g., number of bits,location of bits) to specify, among other things, the operation to beperformed (e.g., opcode) and the operand(s) on which that operation isto be performed and/or other data field(s) (e.g., mask). Someinstruction formats are further broken down though the definition ofinstruction templates (or subformats). For example, the instructiontemplates of a given instruction format may be defined to have differentsubsets of the instruction format's fields (the included fields aretypically in the same order, but at least some have different bitpositions because there are less fields included) and/or defined to havea given field interpreted differently. Thus, each instruction of an ISAis expressed using a given instruction format (and, if defined, in agiven one of the instruction templates of that instruction format) andincludes fields for specifying the operation and the operands. Forexample, an exemplary ADD instruction has a specific opcode and aninstruction format that includes an opcode field to specify that opcodeand operand fields to select operands (source1/destination and source2);and an occurrence of this ADD instruction in an instruction stream willhave specific contents in the operand fields that select specificoperands. A set of SIMD extensions referred to as the Advanced VectorExtensions (AVX) (AVX1 and AVX2) and using the Vector Extensions (VEX)coding scheme has been released and/or published (e.g., see Intel® 64and IA-32 Architectures Software Developer's Manual, September 2014; andsee Intel® Advanced Vector Extensions Programming Reference, October2014).

Exemplary Instruction Formats

Embodiments of the instruction(s) described herein may be embodied indifferent formats. Additionally, exemplary systems, architectures, andpipelines are detailed below. Embodiments of the instruction(s) may beexecuted on such systems, architectures, and pipelines, but are notlimited to those detailed.

Generic Vector Friendly Instruction Format

A vector friendly instruction format is an instruction format that issuited for vector instructions (e.g., there are certain fields specificto vector operations). While embodiments are described in which bothvector and scalar operations are supported through the vector friendlyinstruction format, alternative embodiments use only vector operationsthe vector friendly instruction format.

FIGS. 25A-25B are block diagrams illustrating a generic vector friendlyinstruction format and instruction templates thereof according to someembodiments. FIG. 25A is a block diagram illustrating a generic vectorfriendly instruction format and class A instruction templates thereofaccording to some embodiments; while FIG. 25B is a block diagramillustrating the generic vector friendly instruction format and class Binstruction templates thereof according to some embodiments.Specifically, a generic vector friendly instruction format 2500 forwhich are defined class A and class B instruction templates, both ofwhich include no memory access 2505 instruction templates and memoryaccess 2520 instruction templates. The term generic in the context ofthe vector friendly instruction format refers to the instruction formatnot being tied to any specific instruction set.

While embodiments of the invention will be described in which the vectorfriendly instruction format supports the following: a 64 byte vectoroperand length (or size) with 32 bit (4 byte) or 64 bit (8 byte) dataelement widths (or sizes) (and thus, a 64 byte vector consists of either16 doubleword-size elements or alternatively, 8 quadword-size elements);a 64 byte vector operand length (or size) with 16 bit (2 byte) or 8 bit(1 byte) data element widths (or sizes); a 32 byte vector operand length(or size) with 32 bit (4 byte), 64 bit (8 byte), 16 bit (2 byte), or 8bit (1 byte) data element widths (or sizes); and a 16 byte vectoroperand length (or size) with 32 bit (4 byte), 64 bit (8 byte), 16 bit(2 byte), or 8 bit (1 byte) data element widths (or sizes); alternativeembodiments may support more, less and/or different vector operand sizes(e.g., 256 byte vector operands) with more, less, or different dataelement widths (e.g., 128 bit (16 byte) data element widths).

The class A instruction templates in FIG. 25A include: 1) within the nomemory access 2505 instruction templates there is shown a no memoryaccess, full round control type operation 2510 instruction template anda no memory access, data transform type operation 2515 instructiontemplate; and 2) within the memory access 2520 instruction templatesthere is shown a memory access, temporal 2525 instruction template and amemory access, non-temporal 2530 instruction template. The class Binstruction templates in FIG. 25B include: 1) within the no memoryaccess 2505 instruction templates there is shown a no memory access,write mask control, partial round control type operation 2512instruction template and a no memory access, write mask control, vsizetype operation 2517 instruction template; and 2) within the memoryaccess 2520 instruction templates there is shown a memory access, writemask control 2527 instruction template.

The generic vector friendly instruction format 2500 includes thefollowing fields listed below in the order illustrated in FIGS. 25A-25B.

Format field 2540—a specific value (an instruction format identifiervalue) in this field uniquely identifies the vector friendly instructionformat, and thus occurrences of instructions in the vector friendlyinstruction format in instruction streams. As such, this field isoptional in the sense that it is not needed for an instruction set thathas only the generic vector friendly instruction format.

Base operation field 2542—its content distinguishes different baseoperations.

Register index field 2544—its content, directly or through addressgeneration, specifies the locations of the source and destinationoperands, be they in registers or in memory. These include a sufficientnumber of bits to select N registers from a PxQ (e.g. 32×512, 16×128,32×1024, 64×1024) register file. While in one embodiment N may be up tothree sources and one destination register, alternative embodiments maysupport more or less sources and destination registers (e.g., maysupport up to two sources where one of these sources also acts as thedestination, may support up to three sources where one of these sourcesalso acts as the destination, may support up to two sources and onedestination).

Modifier field 2546—its content distinguishes occurrences ofinstructions in the generic vector instruction format that specifymemory access from those that do not; that is, between no memory access2505 instruction templates and memory access 2520 instruction templates.Memory access operations read and/or write to the memory hierarchy (insome cases specifying the source and/or destination addresses usingvalues in registers), while non-memory access operations do not (e.g.,the source and destinations are registers). While in one embodiment thisfield also selects between three different ways to perform memoryaddress calculations, alternative embodiments may support more, less, ordifferent ways to perform memory address calculations.

Augmentation operation field 2550—its content distinguishes which one ofa variety of different operations to be performed in addition to thebase operation. This field is context specific. In one embodiment of theinvention, this field is divided into a class field 2568, an alpha field2552, and a beta field 2554. The augmentation operation field 2550allows common groups of operations to be performed in a singleinstruction rather than 2, 3, or 4 instructions.

Scale field 2560—its content allows for the scaling of the index field'scontent for memory address generation (e.g., for address generation thatuses 2^(scale)*index+base).

Displacement Field 2562A—its content is used as part of memory addressgeneration (e.g., for address generation that uses2^(scale)*index+base+displacement).

Displacement Factor Field 2562B (note that the juxtaposition ofdisplacement field 2562A directly over displacement factor field 2562Bindicates one or the other is used)—its content is used as part ofaddress generation; it specifies a displacement factor that is to bescaled by the size of a memory access (N)—where N is the number of bytesin the memory access (e.g., for address generation that uses2^(scale)*index+base+scaled displacement). Redundant low-order bits areignored and hence, the displacement factor field's content is multipliedby the memory operands total size (N) in order to generate the finaldisplacement to be used in calculating an effective address. The valueof N is determined by the processor hardware at runtime based on thefull opcode field 2574 (described later herein) and the datamanipulation field 2554C. The displacement field 2562A and thedisplacement factor field 2562B are optional in the sense that they arenot used for the no memory access 2505 instruction templates and/ordifferent embodiments may implement only one or none of the two.

Data element width field 2564—its content distinguishes which one of anumber of data element widths is to be used (in some embodiments for allinstructions; in other embodiments for only some of the instructions).This field is optional in the sense that it is not needed if only onedata element width is supported and/or data element widths are supportedusing some aspect of the opcodes.

Write mask field 2570—its content controls, on a per data elementposition basis, whether that data element position in the destinationvector operand reflects the result of the base operation andaugmentation operation. Class A instruction templates supportmerging-writemasking, while class B instruction templates support bothmerging- and zeroing-writemasking. When merging, vector masks allow anyset of elements in the destination to be protected from updates duringthe execution of any operation (specified by the base operation and theaugmentation operation); in other one embodiment, preserving the oldvalue of each element of the destination where the corresponding maskbit has a 0. In contrast, when zeroing vector masks allow any set ofelements in the destination to be zeroed during the execution of anyoperation (specified by the base operation and the augmentationoperation); in one embodiment, an element of the destination is set to 0when the corresponding mask bit has a 0 value. A subset of thisfunctionality is the ability to control the vector length of theoperation being performed (that is, the span of elements being modified,from the first to the last one); however, it is not necessary that theelements that are modified be consecutive. Thus, the write mask field2570 allows for partial vector operations, including loads, stores,arithmetic, logical, etc. While embodiments of the invention aredescribed in which the write mask field's 2570 content selects one of anumber of write mask registers that contains the write mask to be used(and thus the write mask field's 2570 content indirectly identifies thatmasking to be performed), alternative embodiments instead or additionalallow the mask write field's 2570 content to directly specify themasking to be performed.

Immediate field 2572—its content allows for the specification of animmediate. This field is optional in the sense that is it not present inan implementation of the generic vector friendly format that does notsupport immediate and it is not present in instructions that do not usean immediate.

Class field 2568—its content distinguishes between different classes ofinstructions. With reference to FIGS. 25A-B, the contents of this fieldselect between class A and class B instructions. In FIGS. 25A-B, roundedcorner squares are used to indicate a specific value is present in afield (e.g., class A 2568A and class B 2568B for the class field 2568respectively in FIGS. 25A-B).

Instruction Templates of Class A

In the case of the non-memory access 2505 instruction templates of classA, the alpha field 2552 is interpreted as an RS field 2552A, whosecontent distinguishes which one of the different augmentation operationtypes are to be performed (e.g., round 2552A.1 and data transform2552A.2 are respectively specified for the no memory access, round typeoperation 2510 and the no memory access, data transform type operation2515 instruction templates), while the beta field 2554 distinguisheswhich of the operations of the specified type is to be performed. In theno memory access 2505 instruction templates, the scale field 2560, thedisplacement field 2562A, and the displacement scale filed 2562B are notpresent.

No-Memory Access Instruction Templates—Full Round Control Type Operation

In the no memory access full round control type operation 2510instruction template, the beta field 2554 is interpreted as a roundcontrol field 2554A, whose content(s) provide static rounding. While inthe described embodiments of the invention the round control field 2554Aincludes a suppress all floating-point exceptions (SAE) field 2556 and around operation control field 2558, alternative embodiments may supportmay encode both these concepts into the same field or only have one orthe other of these concepts/fields (e.g., may have only the roundoperation control field 2558).

SAE field 2556—its content distinguishes whether or not to disable theexception event reporting; when the SAE field's 2556 content indicatessuppression is enabled, a given instruction does not report any kind offloating-point exception flag and does not raise any floating-pointexception handler.

Round operation control field 2558—its content distinguishes which oneof a group of rounding operations to perform (e.g., Round-up,Round-down, Round-towards-zero and Round-to-nearest). Thus, the roundoperation control field 2558 allows for the changing of the roundingmode on a per instruction basis. In one embodiment of the inventionwhere a processor includes a control register for specifying roundingmodes, the round operation control field's 2550 content overrides thatregister value.

No Memory Access Instruction Templates—Data Transform Type Operation

In the no memory access data transform type operation 2515 instructiontemplate, the beta field 2554 is interpreted as a data transform field2554B, whose content distinguishes which one of a number of datatransforms is to be performed (e.g., no data transform, swizzle,broadcast).

In the case of a memory access 2520 instruction template of class A, thealpha field 2552 is interpreted as an eviction hint field 2552B, whosecontent distinguishes which one of the eviction hints is to be used (inFIG. 25A, temporal 2552B.1 and non-temporal 2552B.2 are respectivelyspecified for the memory access, temporal 2525 instruction template andthe memory access, non-temporal 2530 instruction template), while thebeta field 2554 is interpreted as a data manipulation field 2554C, whosecontent distinguishes which one of a number of data manipulationoperations (also known as primitives) is to be performed (e.g., nomanipulation; broadcast; up conversion of a source; and down conversionof a destination). The memory access 2520 instruction templates includethe scale field 2560, and optionally the displacement field 2562A or thedisplacement scale field 2562B.

Vector memory instructions perform vector loads from and vector storesto memory, with conversion support. As with regular vector instructions,vector memory instructions transfer data from/to memory in a dataelement-wise fashion, with the elements that are actually transferred isdictated by the contents of the vector mask that is selected as thewrite mask.

Memory Access Instruction Templates—Temporal

Temporal data is data likely to be reused soon enough to benefit fromcaching. This is, however, a hint, and different processors mayimplement it in different ways, including ignoring the hint entirely.

Memory Access Instruction Templates—Non-Temporal

Non-temporal data is data unlikely to be reused soon enough to benefitfrom caching in the 1st-level cache and should be given priority foreviction. This is, however, a hint, and different processors mayimplement it in different ways, including ignoring the hint entirely.

Instruction Templates of Class B

In the case of the instruction templates of class B, the alpha field2552 is interpreted as a write mask control (Z) field 2552C, whosecontent distinguishes whether the write masking controlled by the writemask field 2570 should be a merging or a zeroing.

In the case of the non-memory access 2505 instruction templates of classB, part of the beta field 2554 is interpreted as an RL field 2557A,whose content distinguishes which one of the different augmentationoperation types are to be performed (e.g., round 2557A.1 and vectorlength (VSIZE) 2557A.2 are respectively specified for the no memoryaccess, write mask control, partial round control type operation 2512instruction template and the no memory access, write mask control, VSIZEtype operation 2517 instruction template), while the rest of the betafield 2554 distinguishes which of the operations of the specified typeis to be performed. In the no memory access 2505 instruction templates,the scale field 2560, the displacement field 2562A, and the displacementscale filed 2562B are not present.

In the no memory access, write mask control, partial round control typeoperation 2510 instruction template, the rest of the beta field 2554 isinterpreted as a round operation field 2559A and exception eventreporting is disabled (a given instruction does not report any kind offloating-point exception flag and does not raise any floating-pointexception handler).

Round operation control field 2559A—just as round operation controlfield 2558, its content distinguishes which one of a group of roundingoperations to perform (e.g., Round-up, Round-down, Round-towards-zeroand Round-to-nearest). Thus, the round operation control field 2559Aallows for the changing of the rounding mode on a per instruction basis.In one embodiment of the invention where a processor includes a controlregister for specifying rounding modes, the round operation controlfield's 2550 content overrides that register value.

In the no memory access, write mask control, VSIZE type operation 2517instruction template, the rest of the beta field 2554 is interpreted asa vector length field 2559B, whose content distinguishes which one of anumber of data vector lengths is to be performed on (e.g., 128, 256, or512 byte).

In the case of a memory access 2520 instruction template of class B,part of the beta field 2554 is interpreted as a broadcast field 2557B,whose content distinguishes whether or not the broadcast type datamanipulation operation is to be performed, while the rest of the betafield 2554 is interpreted the vector length field 2559B. The memoryaccess 2520 instruction templates include the scale field 2560, andoptionally the displacement field 2562A or the displacement scale field2562B.

With regard to the generic vector friendly instruction format 2500, afull opcode field 2574 is shown including the format field 2540, thebase operation field 2542, and the data element width field 2564. Whileone embodiment is shown where the full opcode field 2574 includes all ofthese fields, the full opcode field 2574 includes less than all of thesefields in embodiments that do not support all of them. The full opcodefield 2574 provides the operation code (opcode).

The augmentation operation field 2550, the data element width field2564, and the write mask field 2570 allow these features to be specifiedon a per instruction basis in the generic vector friendly instructionformat.

The combination of write mask field and data element width field createtyped instructions in that they allow the mask to be applied based ondifferent data element widths.

The various instruction templates found within class A and class B arebeneficial in different situations. In some embodiments of theinvention, different processors or different cores within a processormay support only class A, only class B, or both classes. For instance, ahigh performance general purpose out-of-order core intended forgeneral-purpose computing may support only class B, a core intendedprimarily for graphics and/or scientific (throughput) computing maysupport only class A, and a core intended for both may support both (ofcourse, a core that has some mix of templates and instructions from bothclasses but not all templates and instructions from both classes iswithin the purview of the invention). Also, a single processor mayinclude multiple cores, all of which support the same class or in whichdifferent cores support different class. For instance, in a processorwith separate graphics and general-purpose cores, one of the graphicscores intended primarily for graphics and/or scientific computing maysupport only class A, while one or more of the general-purpose cores maybe high performance general purpose cores with out of order executionand register renaming intended for general-purpose computing thatsupport only class B. Another processor that does not have a separategraphics core, may include one more general purpose in-order orout-of-order cores that support both class A and class B. Of course,features from one class may also be implement in the other class indifferent embodiments of the invention. Programs written in a high levellanguage would be put (e.g., just in time compiled or staticallycompiled) into an variety of different executable forms, including: 1) aform having only instructions of the class(es) supported by the targetprocessor for execution; or 2) a form having alternative routineswritten using different combinations of the instructions of all classesand having control flow code that selects the routines to execute basedon the instructions supported by the processor which is currentlyexecuting the code.

Exemplary Specific Vector Friendly Instruction Format

FIG. 26A is a block diagram illustrating an exemplary specific vectorfriendly instruction format according to embodiments of the invention.FIG. 26A shows a specific vector friendly instruction format 2600 thatis specific in the sense that it specifies the location, size,interpretation, and order of the fields, as well as values for some ofthose fields. The specific vector friendly instruction format 2600 maybe used to extend the x86 instruction set, and thus some of the fieldsare similar or the same as those used in the existing x86 instructionset and extension thereof (e.g., AVX). This format remains consistentwith the prefix encoding field, real opcode byte field, MOD R/M field,SIB field, displacement field, and immediate fields of the existing x86instruction set with extensions. The fields from FIG. 25 into which thefields from FIG. 26A map are illustrated.

It should be understood that, although embodiments of the invention aredescribed with reference to the specific vector friendly instructionformat 2600 in the context of the generic vector friendly instructionformat 2500 for illustrative purposes, the invention is not limited tothe specific vector friendly instruction format 2600 except whereclaimed. For example, the generic vector friendly instruction format2500 contemplates a variety of possible sizes for the various fields,while the specific vector friendly instruction format 2600 is shown ashaving fields of specific sizes. By way of specific example, while thedata element width field 2564 is illustrated as a one-bit field in thespecific vector friendly instruction format 2600, the invention is notso limited (that is, the generic vector friendly instruction format 2500contemplates other sizes of the data element width field 2564).

The generic vector friendly instruction format 2500 includes thefollowing fields listed below in the order illustrated in FIG. 26A.

EVEX Prefix 2602 (Bytes 0-3)—is encoded in a four-byte form.

Format Field 2540 (EVEX Byte 0, bits [7:0])—the first byte (EVEX Byte 0)is the format field 2540 and it contains 0x62 (the unique value used fordistinguishing the vector friendly instruction format in one embodimentof the invention).

The second-fourth bytes (EVEX Bytes 1-3) include a number of bit fieldsproviding specific capability.

REX field 2605 (EVEX Byte 1, bits [7-5])—consists of a EVEX.R bit field(EVEX Byte 1, bit [7]-R), EVEX.X bit field (EVEX byte 1, bit [6]-X), and2557BEX byte 1, bit [5]-B). The EVEX.R, EVEX.X, and EVEX.B bit fieldsprovide the same functionality as the corresponding VEX bit fields, andare encoded using 1s complement form, i.e. ZMM0 is encoded as 1111B,ZMM15 is encoded as 0000B. Other fields of the instructions encode thelower three bits of the register indexes as is known in the art (rrr,xxx, and bbb), so that Rrrr, Xxxx, and Bbbb may be formed by addingEVEX.R, EVEX.X, and EVEX.B.

REX′ field 2510—this is the first part of the REX′ field 2510 and is theEVEX.R′ bit field (EVEX Byte 1, bit [4]-R′) that is used to encodeeither the upper 16 or lower 16 of the extended 32 register set. In oneembodiment of the invention, this bit, along with others as indicatedbelow, is stored in bit inverted format to distinguish (in thewell-known x86 32-bit mode) from the BOUND instruction, whose realopcode byte is 62, but does not accept in the MOD R/M field (describedbelow) the value of 11 in the MOD field; alternative embodiments of theinvention do not store this and the other indicated bits below in theinverted format. A value of 1 is used to encode the lower 16 registers.In other words, R′Rrrr is formed by combining EVEX.R′, EVEX.R, and theother RRR from other fields.

Opcode map field 2615 (EVEX byte 1, bits [3:0]-mmmm)—its content encodesan implied leading opcode byte (0F, 0F 38, or 0F 3).

Data element width field 2564 (EVEX byte 2, bit [7]-W)—is represented bythe notation EVEX.W. EVEX.W is used to define the granularity (size) ofthe datatype (either 32-bit data elements or 64-bit data elements).

EVEX.vvvv 2620 (EVEX Byte 2, bits [6:3]-vvvv)—the role of EVEX.vvvv mayinclude the following: 1) EVEX.vvvv encodes the first source registeroperand, specified in inverted (1s complement) form and is valid forinstructions with 2 or more source operands; 2) EVEX.vvvv encodes thedestination register operand, specified in is complement form forcertain vector shifts; or 3) EVEX.vvvv does not encode any operand, thefield is reserved and should contain 1111b. Thus, EVEX.vvvv field 2620encodes the 4 low-order bits of the first source register specifierstored in inverted (ls complement) form. Depending on the instruction,an extra different EVEX bit field is used to extend the specifier sizeto 32 registers.

EVEX.U 2568 Class field (EVEX byte 2, bit [2]-U)—If EVEX.U=0, itindicates class A or EVEX.U0; if EVEX.U=1, it indicates class B orEVEX.U1.

Prefix encoding field 2625 (EVEX byte 2, bits [1:0]-pp)—providesadditional bits for the base operation field. In addition to providingsupport for the legacy SSE instructions in the EVEX prefix format, thisalso has the benefit of compacting the SIMD prefix (rather thanrequiring a byte to express the SIMD prefix, the EVEX prefix requiresonly 2 bits). In one embodiment, to support legacy SSE instructions thatuse a SIMD prefix (66H, F2H, F3H) in both the legacy format and in theEVEX prefix format, these legacy SIMD prefixes are encoded into the SIMDprefix encoding field; and at runtime are expanded into the legacy SIMDprefix prior to being provided to the decoder's PLA (so the PLA canexecute both the legacy and EVEX format of these legacy instructionswithout modification). Although newer instructions could use the EVEXprefix encoding field's content directly as an opcode extension, certainembodiments expand in a similar fashion for consistency but allow fordifferent meanings to be specified by these legacy SIMD prefixes. Analternative embodiment may redesign the PLA to support the 2-bit SIMDprefix encodings, and thus not require the expansion.

Alpha field 2552 (EVEX byte 3, bit [7]-EH; also known as EVEX.EH,EVEX.rs, EVEX.RL, EVEX.write mask control, and EVEX.N; also illustratedwith α)—as previously described, this field is context specific.

Beta field 2554 (EVEX byte 3, bits [6:4]-SSS, also known as EVEX.s₂₋₀,EVEX.r₂₋₀, EVEX.rr1, EVEX.LL0, EVEX.LLB; also illustrated with βββ)—aspreviously described, this field is context specific.

REX′ field 2510—this is the remainder of the REX′ field and is theEVEX.V′ bit field (EVEX Byte 3, bit [3]-V′) that may be used to encodeeither the upper 16 or lower 16 of the extended 32 register set. Thisbit is stored in bit inverted format. A value of 1 is used to encode thelower 16 registers. In other words, V′VVVV is formed by combiningEVEX.V′, EVEX.vvvv.

Write mask field 2570 (EVEX byte 3, bits [2:0]-kkk)—its contentspecifies the index of a register in the write mask registers aspreviously described. In one embodiment of the invention, the specificvalue EVEX.kkk=000 has a special behavior implying no write mask is usedfor the particular instruction (this may be implemented in a variety ofways including the use of a write mask hardwired to all ones or hardwarethat bypasses the masking hardware).

Real Opcode Field 2630 (Byte 4) is also known as the opcode byte. Partof the opcode is specified in this field.

MOD R/M Field 2640 (Byte 5) includes MOD field 2642, Reg field 2644, andR/M field 2646. As previously described, the MOD field's 2642 contentdistinguishes between memory access and non-memory access operations.The role of Reg field 2644 can be summarized to two situations: encodingeither the destination register operand or a source register operand orbe treated as an opcode extension and not used to encode any instructionoperand. The role of R/M field 2646 may include the following: encodingthe instruction operand that references a memory address or encodingeither the destination register operand or a source register operand.

Scale, Index, Base (SIB) Byte (Byte 6)—As previously described, thecontent of SIB 2650 is used for memory address generation. SIB.xxx 2654and SIB.bbb 2656—the contents of these fields have been previouslyreferred to with regard to the register indexes Xxxx and Bbbb.

Displacement field 2562A (Bytes 7-10)—when MOD field 2642 contains 10,bytes 7-10 are the displacement field 2562A, and it works the same asthe legacy 32-bit displacement (disp32) and works at byte granularity.

Displacement factor field 2562B (Byte 7)—when MOD field 2642 contains01, byte 7 is the displacement factor field 2562B. The location of thisfield is that same as that of the legacy x86 instruction set 8-bitdisplacement (disp8), which works at byte granularity. Since disp8 issign extended, it can only address between −128 and 127 bytes offsets;in terms of 64-byte cache lines, disp8 uses 8 bits that can be set toonly four really useful values −128, −64, 0, and 64; since a greaterrange is often needed, disp32 is used; however, disp32 requires 4 bytes.In contrast to disp8 and disp32, the displacement factor field 2562B isa reinterpretation of disp8; when using displacement factor field 2562B,the actual displacement is determined by the content of the displacementfactor field multiplied by the size of the memory operand access (N).This type of displacement is referred to as disp8*N. This reduces theaverage instruction length (a single byte of used for the displacementbut with a much greater range). Such compressed displacement assumesthat the effective displacement is multiple of the granularity of thememory access, and hence, the redundant low-order bits of the addressoffset do not need to be encoded. In other words, the displacementfactor field 2562B substitutes the legacy x86 instruction set 8-bitdisplacement. Thus, the displacement factor field 2562B is encoded thesame way as an x86 instruction set 8-bit displacement (so no changes inthe ModRM/SIB encoding rules) with the only exception that disp8 isoverloaded to disp8*N. In other words, there are no changes in theencoding rules or encoding lengths but only in the interpretation of thedisplacement value by hardware (which needs to scale the displacement bythe size of the memory operand to obtain a byte-wise address offset).Immediate field 2572 operates as previously described.

Full OpCode Field

FIG. 26B is a block diagram illustrating the fields of the specificvector friendly instruction format 2600 that make up the full opcodefield 2574 according to one embodiment of the invention. Specifically,the full opcode field 2574 includes the format field 2540, the baseoperation field 2542, and the data element width (W) field 2564. Thebase operation field 2542 includes the prefix encoding field 2625, theopcode map field 2615, and the real opcode field 2630.

Register Index Field

FIG. 26C is a block diagram illustrating the fields of the specificvector friendly instruction format 2600 that make up the register indexfield 2544 according to one embodiment of the invention. Specifically,the register index field 2544 includes the REX 2605 field, the REX′ 2610field, the MODR/M.reg field 2644, the MODR/M.r/m field 2646, the VVVVfield 2620, xxx field 2654, and the bbb field 2656.

Augmentation Operation Field

FIG. 26D is a block diagram illustrating the fields of the specificvector friendly instruction format 2600 that make up the augmentationoperation field 2550 according to one embodiment of the invention. Whenthe class (U) field 2568 contains 0, it signifies EVEX.U0 (class A2568A); when it contains 1, it signifies EVEX.U1 (class B 2568B). WhenU=0 and the MOD field 2642 contains 11 (signifying a no memory accessoperation), the alpha field 2552 (EVEX byte 3, bit [7]-EH) isinterpreted as the rs field 2552A. When the rs field 2552A contains a 1(round 2552A.1), the beta field 2554 (EVEX byte 3, bits [6:4]-SSS) isinterpreted as the round control field 2554A. The round control field2554A includes a one-bit SAE field 2556 and a two-bit round operationfield 2558. When the rs field 2552A contains a 0 (data transform2552A.2), the beta field 2554 (EVEX byte 3, bits [6:4]-SSS) isinterpreted as a three-bit data transform field 2554B. When U=0 and theMOD field 2642 contains 00, 01, or 10 (signifying a memory accessoperation), the alpha field 2552 (EVEX byte 3, bit [7]-EH) isinterpreted as the eviction hint (EH) field 2552B and the beta field2554 (EVEX byte 3, bits [6:4]-SSS) is interpreted as a three bit datamanipulation field 2554C.

When U=1, the alpha field 2552 (EVEX byte 3, bit [7]-EH) is interpretedas the write mask control (Z) field 2552C. When U=1 and the MOD field2642 contains 11 (signifying a no memory access operation), part of thebeta field 2554 (EVEX byte 3, bit [4]-S₀) is interpreted as the RL field2557A; when it contains a 1 (round 2557A.1) the rest of the beta field2554 (EVEX byte 3, bit [6-5]-S₂₋₁) is interpreted as the round operationfield 2559A, while when the RL field 2557A contains a 0 (VSIZE 2557A.2)the rest of the beta field 2554 (EVEX byte 3, bit [6-5]-S₂₋₁) isinterpreted as the vector length field 2559B (EVEX byte 3, bit[6-5]-L₁₋₀). When U=1 and the MOD field 2642 contains 00, 01, or 10(signifying a memory access operation), the beta field 2554 (EVEX byte3, bits [6:4]-SSS) is interpreted as the vector length field 2559B (EVEXbyte 3, bit [6-5]-L₁₋₀) and the broadcast field 2557B (EVEX byte 3, bit[4]-B).

Exemplary Register Architecture

FIG. 27 is a block diagram of a register architecture 2700 according toone embodiment of the invention. In the embodiment illustrated, thereare 32 vector registers 2710 that are 512 bits wide; these registers arereferenced as zmm0 through zmm31. The lower order 256 bits of the lower16 zmm registers are overlaid on registers ymm0-16. The lower order 128bits of the lower 16 zmm registers (the lower order 128 bits of the ymmregisters) are overlaid on registers xmm0-15. The specific vectorfriendly instruction format 2600 operates on these overlaid registerfile as illustrated in the below tables.

Adjustable Vector Length Class Operations Registers InstructionTemplates A (FIG. 2510, 2515, zmm registers (the vector length is thatdo not include the 25A; U = 0) 2525, 2530 64 byte) vector length field B(FIG. 2512 zmm registers (the vector length is 2559B 25B; U = 1) 64byte) Instruction templates B (FIG. 2517, 2527 zmm, ymm, or xmmregisters (the that do include the 25B; U = 1) vector length is 64-byte,32 byte, or vector length field 16 byte) depending on the vector 2559Blength field 2559B

In other words, the vector length field 2559B selects between a maximumlength and one or more other shorter lengths, where each such shorterlength is half the length of the preceding length; and instructionstemplates without the vector length field 2559B operate on the maximumvector length. Further, in one embodiment, the class B instructiontemplates of the specific vector friendly instruction format 2600operate on packed or scalar single/double-precision floating point dataand packed or scalar integer data. Scalar operations are operationsperformed on the lowest order data element position in an zmm/ymm/xmmregister; the higher order data element positions are either left thesame as they were prior to the instruction or zeroed depending on theembodiment.

Write mask registers 2715—in the embodiment illustrated, there are 8write mask registers (k0 through k7), each 64 bits in size. In analternate embodiment, the write mask registers 2715 are 16 bits in size.As previously described, in one embodiment of the invention, the vectormask register k0 cannot be used as a write mask; when the encoding thatwould normally indicate k0 is used for a write mask, it selects ahardwired write mask of 0xFFFF, effectively disabling write masking forthat instruction.

General-purpose registers 2725—in the embodiment illustrated, there aresixteen 64-bit general-purpose registers that are used along with theexisting x86 addressing modes to address memory operands. Theseregisters are referenced by the names RAX, RBX, RCX, RDX, RBP, RSI, RDI,RSP, and R8 through R15.

Scalar floating point stack register file (x87 stack) 2745, on which isaliased the MMX packed integer flat register file 2750—in the embodimentillustrated, the x87 stack is an eight-element stack used to performscalar floating-point operations on 32/64/80-bit floating point datausing the x87 instruction set extension; while the MMX registers areused to perform operations on 64-bit packed integer data, as well as tohold operands for some operations performed between the MMX and XMMregisters.

Alternative embodiments of the invention may use wider or narrowerregisters. Additionally, alternative embodiments of the invention mayuse more, less, or different register files and registers.

Exemplary Core Architectures, Processors, and Computer Architectures

Processor cores may be implemented in different ways, for differentpurposes, and in different processors. For instance, implementations ofsuch cores may include: 1) a general purpose in-order core intended forgeneral-purpose computing; 2) a high performance general purposeout-of-order core intended for general-purpose computing; 3) a specialpurpose core intended primarily for graphics and/or scientific(throughput) computing. Implementations of different processors mayinclude: 1) a CPU including one or more general purpose in-order coresintended for general-purpose computing and/or one or more generalpurpose out-of-order cores intended for general-purpose computing; and2) a coprocessor including one or more special purpose cores intendedprimarily for graphics and/or scientific (throughput). Such differentprocessors lead to different computer system architectures, which mayinclude: 1) the coprocessor on a separate chip from the CPU; 2) thecoprocessor on a separate die in the same package as a CPU; 3) thecoprocessor on the same die as a CPU (in which case, such a coprocessoris sometimes referred to as special purpose logic, such as integratedgraphics and/or scientific (throughput) logic, or as special purposecores); and 4) a system on a chip that may include on the same die thedescribed CPU (sometimes referred to as the application core(s) orapplication processor(s)), the above described coprocessor, andadditional functionality. Exemplary core architectures are describednext, followed by descriptions of exemplary processors and computerarchitectures.

Exemplary Core Architectures

In-Order and Out-of-Order Core Block Diagram

FIG. 28A is a block diagram illustrating both an exemplary in-orderpipeline and an exemplary register renaming, out-of-orderissue/execution pipeline according to embodiments of the invention. FIG.28B is a block diagram illustrating both an exemplary embodiment of anin-order architecture core and an exemplary register renaming,out-of-order issue/execution architecture core to be included in aprocessor according to embodiments of the invention. The solid linedboxes in FIGS. 28A-B illustrate the in-order pipeline and in-order core,while the optional addition of the dashed lined boxes illustrates theregister renaming, out-of-order issue/execution pipeline and core. Giventhat the in-order aspect is a subset of the out-of-order aspect, theout-of-order aspect will be described.

In FIG. 28A, a processor pipeline 2800 includes a fetch stage 2802, alength decode stage 2804, a decode stage 2806, an allocation stage 2808,a renaming stage 2810, a scheduling (also known as a dispatch or issue)stage 2812, a register read/memory read stage 2814, an execute stage2816, a write back/memory write stage 2818, an exception handling stage2822, and a commit stage 2824.

FIG. 28B shows processor core 2890 including a front-end unit 2830coupled to an execution engine unit 2850, and both are coupled to amemory unit 2870. The core 2890 may be a reduced instruction setcomputing (RISC) core, a complex instruction set computing (CISC) core,a very long instruction word (VLIW) core, or a hybrid or alternativecore type. As yet another option, the core 2890 may be a special-purposecore, such as, for example, a network or communication core, compressionengine, coprocessor core, general purpose computing graphics processingunit (GPGPU) core, graphics core, or the like.

The front-end unit 2830 includes a branch prediction unit 2832 coupledto an instruction cache unit 2834, which is coupled to an instructiontranslation lookaside buffer (TLB) 2836, which is coupled to aninstruction fetch unit 2838, which is coupled to a decode unit 2840. Thedecode unit 2840 (or decoder) may decode instructions, and generate asan output one or more micro-operations, micro-code entry points,microinstructions, other instructions, or other control signals, whichare decoded from, or which otherwise reflect, or are derived from, theoriginal instructions. The decode unit 2840 may be implemented usingvarious different mechanisms. Examples of suitable mechanisms include,but are not limited to, look-up tables, hardware implementations,programmable logic arrays (PLAs), microcode read only memories (ROMs),etc. In one embodiment, the core 2890 includes a microcode ROM or othermedium that stores microcode for certain macroinstructions (e.g., indecode unit 2840 or otherwise within the front-end unit 2830). Thedecode unit 2840 is coupled to a rename/allocator unit 2852 in theexecution engine unit 2850.

The execution engine unit 2850 includes the rename/allocator unit 2852coupled to a retirement unit 2854 and a set of one or more schedulerunit(s) 2856. The scheduler unit(s) 2856 represents any number ofdifferent schedulers, including reservations stations, centralinstruction window, etc. The scheduler unit(s) 2856 is coupled to thephysical register file(s) unit(s) 2858. Each of the physical registerfile(s) units 2858 represents one or more physical register files,different ones of which store one or more different data types, such asscalar integer, scalar floating point, packed integer, packed floatingpoint, vector integer, vector floating point, status (e.g., aninstruction pointer that is the address of the next instruction to beexecuted), etc. In one embodiment, the physical register file(s) unit2858 comprises a vector registers unit, a write mask registers unit, anda scalar registers unit. These register units may provide architecturalvector registers, vector mask registers, and general-purpose registers.The physical register file(s) unit(s) 2858 is overlapped by theretirement unit 2854 to illustrate various ways in which registerrenaming and out-of-order execution may be implemented (e.g., using areorder buffer(s) and a retirement register file(s); using a futurefile(s), a history buffer(s), and a retirement register file(s); using aregister maps and a pool of registers; etc.). The retirement unit 2854and the physical register file(s) unit(s) 2858 are coupled to theexecution cluster(s) 2860. The execution cluster(s) 2860 includes a setof one or more execution units 2862 and a set of one or more memoryaccess units 2864. The execution units 2862 may perform variousoperations (e.g., shifts, addition, subtraction, multiplication) and onvarious types of data (e.g., scalar floating point, packed integer,packed floating point, vector integer, vector floating point). Whilesome embodiments may include a number of execution units dedicated tospecific functions or sets of functions, other embodiments may includeonly one execution unit or multiple execution units that all perform allfunctions. The scheduler unit(s) 2856, physical register file(s) unit(s)2858, and execution cluster(s) 2860 are shown as being possibly pluralbecause certain embodiments create separate pipelines for certain typesof data/operations (e.g., a scalar integer pipeline, a scalar floatingpoint/packed integer/packed floating point/vector integer/vectorfloating point pipeline, and/or a memory access pipeline that each havetheir own scheduler unit, physical register file(s) unit, and/orexecution cluster—and in the case of a separate memory access pipeline,certain embodiments are implemented in which only the execution clusterof this pipeline has the memory access unit(s) 2864). It should also beunderstood that where separate pipelines are used, one or more of thesepipelines may be out-of-order issue/execution and the rest in-order.

The set of memory access units 2864 is coupled to the memory unit 2870,which includes a data TLB unit 2872 coupled to a data cache unit 2874coupled to a level 2 (L2) cache unit 2876. In one exemplary embodiment,the memory access units 2864 may include a load unit, a store addressunit, and a store data unit, each of which is coupled to the data TLBunit 2872 in the memory unit 2870. The instruction cache unit 2834 isfurther coupled to a level 2 (L2) cache unit 2876 in the memory unit2870. The L2 cache unit 2876 is coupled to one or more other levels ofcache and eventually to a main memory.

By way of example, the exemplary register renaming, out-of-orderissue/execution core architecture may implement the pipeline 2800 asfollows: 1) the instruction fetch 2838 performs the fetch and lengthdecoding stages 2802 and 2804; 2) the decode unit 2840 performs thedecode stage 2806; 3) the rename/allocator unit 2852 performs theallocation stage 2808 and renaming stage 2810; 4) the scheduler unit(s)2856 performs the schedule stage 2812; 5) the physical register file(s)unit(s) 2858 and the memory unit 2870 perform the register read/memoryread stage 2814; the execution cluster 2860 perform the execute stage2816; 6) the memory unit 2870 and the physical register file(s) unit(s)2858 perform the write back/memory write stage 2818; 7) various unitsmay be involved in the exception handling stage 2822; and 8) theretirement unit 2854 and the physical register file(s) unit(s) 2858perform the commit stage 2824.

The core 2890 may support one or more instructions sets (e.g., the x86instruction set (with some extensions that have been added with newerversions); the MIPS instruction set of MIPS Technologies of Sunnyvale,Calif.; the ARM instruction set (with optional additional extensionssuch as NEON) of ARM Holdings of Sunnyvale, Calif.), including theinstruction(s) described herein. In one embodiment, the core 2890includes logic to support a packed data instruction set extension (e.g.,AVX1, AVX2), thereby allowing the operations used by many multimediaapplications to be performed using packed data.

It should be understood that the core may support multithreading(executing two or more parallel sets of operations or threads), and maydo so in a variety of ways including time sliced multithreading,simultaneous multithreading (where a single physical core provides alogical core for each of the threads that physical core issimultaneously multithreading), or a combination thereof (e.g., timesliced fetching and decoding and simultaneous multithreading thereaftersuch as in the Intel® Hyperthreading technology).

While register renaming is described in the context of out-of-orderexecution, it should be understood that register renaming may be used inan in-order architecture. While the illustrated embodiment of theprocessor also includes separate instruction and data cache units2834/2874 and a shared L2 cache unit 2876, alternative embodiments mayhave a single internal cache for both instructions and data, such as,for example, a Level 1 (L1) internal cache, or multiple levels ofinternal cache. In some embodiments, the system may include acombination of an internal cache and an external cache that is externalto the core and/or the processor. Alternatively, all of the cache may beexternal to the core and/or the processor.

Specific Exemplary In-Order Core Architecture

FIGS. 29A-B illustrate a block diagram of a more specific exemplaryin-order core architecture, which core would be one of several logicblocks (including other cores of the same type and/or different types)in a chip. The logic blocks communicate through a high-bandwidthinterconnect network (e.g., a ring network) with some fixed functionlogic, memory I/O interfaces, and other necessary I/O logic, dependingon the application.

FIG. 29A is a block diagram of a single processor core, along with itsconnection to the on-die interconnect network 2902 and with its localsubset of the Level 2 (L2) cache 2904, according to embodiments of theinvention. In one embodiment, an instruction decoder 2900 supports thex86 instruction set with a packed data instruction set extension. An L1cache 2906 allows low-latency accesses to cache memory into the scalarand vector units. While in one embodiment (to simplify the design), ascalar unit 2908 and a vector unit 2910 use separate register sets(respectively, scalar registers 2912 and vector registers 2914) and datatransferred between them is written to memory and then read back in froma level 1 (L1) cache 2906, alternative embodiments of the invention mayuse a different approach (e.g., use a single register set or include acommunication path that allow data to be transferred between the tworegister files without being written and read back).

The local subset of the L2 cache 2904 is part of a global L2 cache thatis divided into separate local subsets, one per processor core. Eachprocessor core has a direct access path to its own local subset of theL2 cache 2904. Data read by a processor core is stored in its L2 cachesubset 2904 and can be accessed quickly, in parallel with otherprocessor cores accessing their own local L2 cache subsets. Data writtenby a processor core is stored in its own L2 cache subset 2904 and isflushed from other subsets, if necessary. The ring network ensurescoherency for shared data. The ring network is bi-directional to allowagents such as processor cores, L2 caches and other logic blocks tocommunicate with each other within the chip. Each ring data-path is1012-bits wide per direction.

FIG. 29B is an expanded view of part of the processor core in FIG. 29Aaccording to embodiments of the invention. FIG. 29B includes an L1 datacache 2906A part of the L1 cache 2904, as well as more detail regardingthe vector unit 2910 and the vector registers 2914. Specifically, thevector unit 2910 is a 16-wide vector processing unit (VPU) (see the16-wide ALU 2928), which executes one or more of integer,single-precision float, and double-precision float instructions. The VPUsupports swizzling the register inputs with swizzle unit 2920, numericconversion with numeric convert units 2922A-B, and replication withreplication unit 2924 on the memory input. Write mask registers 2926allow predicating resulting vector writes.

FIG. 30 is a block diagram of a processor 3000 that may have more thanone core, may have an integrated memory controller, and may haveintegrated graphics according to embodiments of the invention. The solidlined boxes in FIG. 30 illustrate a processor 3000 with a single core3002A, a system agent 3010, a set of one or more bus controller units3016, while the optional addition of the dashed lined boxes illustratesan alternative processor 3000 with multiple cores 3002A-N, a set of oneor more integrated memory controller unit(s) 3014 in the system agentunit 3010, and special purpose logic 3008.

Thus, different implementations of the processor 3000 may include: 1) aCPU with the special purpose logic 3008 being integrated graphics and/orscientific (throughput) logic (which may include one or more cores), andthe cores 3002A-N being one or more general purpose cores (e.g., generalpurpose in-order cores, general purpose out-of-order cores, acombination of the two); 2) a coprocessor with the cores 3002A-N being alarge number of special purpose cores intended primarily for graphicsand/or scientific (throughput); and 3) a coprocessor with the cores3002A-N being a large number of general purpose in-order cores. Thus,the processor 3000 may be a general-purpose processor, coprocessor orspecial-purpose processor, such as, for example, a network orcommunication processor, compression engine, graphics processor, GPGPU(general purpose graphics processing unit), a high-throughput manyintegrated core (MIC) coprocessor (including 30 or more cores), embeddedprocessor, or the like. The processor may be implemented on one or morechips. The processor 3000 may be a part of and/or may be implemented onone or more substrates using any of a number of process technologies,such as, for example, BiCMOS, CMOS, or NMOS.

The memory hierarchy includes one or more levels of cache within thecores, a set or one or more shared cache units 3006, and external memory(not shown) coupled to the set of integrated memory controller units3014. The set of shared cache units 3006 may include one or moremid-level caches, such as level 2 (L2), level 3 (L3), level 4 (L4), orother levels of cache, a last level cache (LLC), and/or combinationsthereof. While in one embodiment a ring based interconnect unit 3012interconnects the special purpose logic 3008 (integrated graphics logicis an example of and is also referred to herein as special purposelogic), the set of shared cache units 3006, and the system agent unit3010/integrated memory controller unit(s) 3014, alternative embodimentsmay use any number of well-known techniques for interconnecting suchunits. In one embodiment, coherency is maintained between one or morecache units 3006 and cores 3002A-N.

In some embodiments, one or more of the cores 3002A-N are capable ofmulti-threading. The system agent 3010 includes those componentscoordinating and operating cores 3002A-N. The system agent unit 3010 mayinclude for example a power control unit (PCU) and a display unit. ThePCU may be or include logic and components needed for regulating thepower state of the cores 3002A-N and the special purpose logic 3008. Thedisplay unit is for driving one or more externally connected displays.

The cores 3002A-N may be homogenous or heterogeneous in terms ofarchitecture instruction set; that is, two or more of the cores 3002A-Nmay be capable of execution the same instruction set, while others maybe capable of executing only a subset of that instruction set or adifferent instruction set.

Exemplary Computer Architectures

FIGS. 31-34 are block diagrams of exemplary computer architectures.Other system designs and configurations known in the arts for laptops,desktops, handheld PCs, personal digital assistants, engineeringworkstations, servers, network devices, network hubs, switches, embeddedprocessors, digital signal processors (DSPs), graphics devices, videogame devices, set-top boxes, micro controllers, cell phones, portablemedia players, hand held devices, and various other electronic devices,are also suitable. In general, a huge variety of systems or electronicdevices capable of incorporating a processor and/or other executionlogic as disclosed herein are generally suitable.

Referring now to FIG. 31, shown is a block diagram of a system 3100 inaccordance with one embodiment of the present invention. The system 3100may include one or more processors 3110, 3115, which are coupled to acontroller hub 3120. In one embodiment the controller hub 3120 includesa graphics memory controller hub (GMCH) 3190 and an Input/Output Hub(IOH) 3150 (which may be on separate chips); the GMCH 3190 includesmemory and graphics controllers to which are coupled memory 3140 and acoprocessor 3145; the IOH 3150 couples input/output (I/O) devices 3160to the GMCH 3190. Alternatively, one or both of the memory and graphicscontrollers are integrated within the processor (as described herein),the memory 3140 and the coprocessor 3145 are coupled directly to theprocessor 3110, and the controller hub 3120 in a single chip with theIOH 3150.

The optional nature of additional processors 3115 is denoted in FIG. 31with broken lines. Each processor 3110, 3115 may include one or more ofthe processing cores described herein and may be some version of theprocessor 3000.

The memory 3140 may be, for example, dynamic random-access memory(DRAM), phase change memory (PCM), or a combination of the two. For atleast one embodiment, the controller hub 3120 communicates with theprocessor(s) 3110, 3115 via a multi-drop bus, such as a frontside bus(FSB), point-to-point interface such as QuickPath Interconnect (QPI), orsimilar connection 3195.

In one embodiment, the coprocessor 3145 is a special-purpose processor,such as, for example, a high-throughput MIC processor, a network orcommunication processor, compression engine, graphics processor, GPGPU,embedded processor, or the like. In one embodiment, controller hub 3120may include an integrated graphics accelerator.

There can be a variety of differences between the physical resources3110, 3115 in terms of a spectrum of metrics of merit includingarchitectural, microarchitectural, thermal, power consumptioncharacteristics, and the like.

In one embodiment, the processor 3110 executes instructions that controldata processing operations of a general type. Embedded within theinstructions may be coprocessor instructions. The processor 3110recognizes these coprocessor instructions as being of a type that shouldbe executed by the attached coprocessor 3145. Accordingly, the processor3110 issues these coprocessor instructions (or control signalsrepresenting coprocessor instructions) on a coprocessor bus or otherinterconnect, to coprocessor 3145. Coprocessor(s) 3145 accept andexecute the received coprocessor instructions.

Referring now to FIG. 32, shown is a block diagram of a first morespecific exemplary system 3200 in accordance with an embodiment of thepresent invention. As shown in FIG. 32, multiprocessor system 3200 is apoint-to-point interconnect system, and includes a first processor 3270and a second processor 3280 coupled via a point-to-point interconnect3250. Each of processors 3270 and 3280 may be some version of theprocessor 3000. In one embodiment of the invention, processors 3270 and3280 are respectively processors 3110 and 3115, while coprocessor 3238is coprocessor 3145. In another embodiment, processors 3270 and 3280 arerespectively processor 3110 coprocessor 3145.

Processors 3270 and 3280 are shown including integrated memorycontroller (IMC) units 3272 and 3282, respectively. Processor 3270 alsoincludes as part of its bus controller units point-to-point (P-P)interfaces 3276 and 3278; similarly, second processor 3280 includes P-Pinterfaces 3286 and 3288. Processors 3270, 3280 may exchange informationvia a point-to-point (P-P) interface 3250 using P-P interface circuits3278, 3288. As shown in FIG. 32, IMCs 3272 and 3282 couple theprocessors to respective memories, namely a memory 3232 and a memory3234, which may be portions of main memory locally attached to therespective processors.

Processors 3270, 3280 may each exchange information with a chipset 3290via individual P-P interfaces 3252, 3254 using point to point interfacecircuits 3276, 3294, 3286, 3298. Chipset 3290 may optionally exchangeinformation with the coprocessor 3238 via a high-performance interface3292. In one embodiment, the coprocessor 3238 is a special-purposeprocessor, such as, for example, a high-throughput MIC processor, anetwork or communication processor, compression engine, graphicsprocessor, GPGPU, embedded processor, or the like.

A shared cache (not shown) may be included in either processor oroutside of both processors yet connected with the processors via P-Pinterconnect, such that either or both processors' local cacheinformation may be stored in the shared cache if a processor is placedinto a low power mode.

Chipset 3290 may be coupled to a first bus 3216 via an interface 3296.In one embodiment, first bus 3216 may be a Peripheral ComponentInterconnect (PCI) bus, or a bus such as a PCI Express bus or anotherthird generation I/O interconnect bus, although the scope of the presentinvention is not so limited.

As shown in FIG. 32, various I/O devices 3214 may be coupled to firstbus 3216, along with a bus bridge 3218 which couples first bus 3216 to asecond bus 3220. In one embodiment, one or more additional processor(s)3215, such as coprocessors, high-throughput MIC processors, GPGPU's,accelerators (such as, e.g., graphics accelerators or digital signalprocessing (DSP) units), field programmable gate arrays, or any otherprocessor, are coupled to first bus 3216. In one embodiment, second bus3220 may be a low pin count (LPC) bus. Various devices may be coupled toa second bus 3220 including, for example, a keyboard and/or mouse 3222,communication devices 3227 and a storage unit 3228 such as a disk driveor other mass storage device which may include instructions/code anddata 3230, in one embodiment. Further, an audio I/O 3224 may be coupledto the second bus 3220. Note that other architectures are possible. Forexample, instead of the point-to-point architecture of FIG. 32, a systemmay implement a multi-drop bus or other such architecture.

Referring now to FIG. 33, shown is a block diagram of a second morespecific exemplary system 3300 in accordance with an embodiment of thepresent invention. Like elements in FIGS. 32 and 33 bear like referencenumerals, and certain aspects of FIG. 32 have been omitted from FIG. 33in order to avoid obscuring other aspects of FIG. 33.

FIG. 33 illustrates that the processors 3270, 3280 may includeintegrated memory and I/O control logic (“CL”) 3372 and 3382,respectively. Thus, the CL 3372, 3382 include integrated memorycontroller units and include I/O control logic. FIG. 33 illustrates thatnot only are the memories 3232, 3234 coupled to the CL 3372, 3382, butalso that I/O devices 3314 are also coupled to the control logic 3372,3382. Legacy I/O devices 3315 are coupled to the chipset 3290.

Referring now to FIG. 34, shown is a block diagram of a SoC 3400 inaccordance with an embodiment of the present invention. Similar elementsin FIG. 30 bear like reference numerals. Also, dashed lined boxes areoptional features on more advanced SoCs. In FIG. 34, an interconnectunit(s) 3402 is coupled to: an application processor 3410 which includesa set of one or more cores 3002A-N, which include cache units 3004A-N,and shared cache unit(s) 3006; a system agent unit 3010; a buscontroller unit(s) 3016; an integrated memory controller unit(s) 3014; aset or one or more coprocessors 3420 which may include integratedgraphics logic, an image processor, an audio processor, and a videoprocessor; an static random access memory (SRAM) unit 3430; a directmemory access (DMA) unit 3432; and a display unit 3440 for coupling toone or more external displays. In one embodiment, the coprocessor(s)3420 include a special-purpose processor, such as, for example, anetwork or communication processor, compression engine, GPGPU, ahigh-throughput MIC processor, embedded processor, or the like.

Embodiments of the mechanisms disclosed herein may be implemented inhardware, software, firmware, or a combination of such implementationapproaches. Embodiments of the invention may be implemented as computerprograms or program code executing on programmable systems comprising atleast one processor, a storage system (including volatile andnon-volatile memory and/or storage elements), at least one input device,and at least one output device.

Program code, such as code 3230 illustrated in FIG. 32, may be appliedto input instructions to perform the functions described herein andgenerate output information. The output information may be applied toone or more output devices, in known fashion. For purposes of thisapplication, a processing system includes any system that has aprocessor, such as, for example; a digital signal processor (DSP), amicrocontroller, an application specific integrated circuit (ASIC), or amicroprocessor.

The program code may be implemented in a high level procedural orobject-oriented programming language to communicate with a processingsystem. The program code may also be implemented in assembly or machinelanguage, if desired. In fact, the mechanisms described herein are notlimited in scope to any particular programming language. In any case,the language may be a compiled or interpreted language.

One or more aspects of at least one embodiment may be implemented byrepresentative instructions stored on a machine-readable medium whichrepresents various logic within the processor, which when read by amachine causes the machine to fabricate logic to perform the techniquesdescribed herein. Such representations, known as “IP cores” may bestored on a tangible, machine readable medium and supplied to variouscustomers or manufacturing facilities to load into the fabricationmachines that actually make the logic or processor.

Such machine-readable storage media may include, without limitation,non-transitory, tangible arrangements of articles manufactured or formedby a machine or device, including storage media such as hard disks, anyother type of disk including floppy disks, optical disks, compact diskread-only memories (CD-ROMs), compact disk rewritable's (CD-RWs), andmagneto-optical disks, semiconductor devices such as read-only memories(ROMs), random access memories (RAMs) such as dynamic random accessmemories (DRAMs), static random access memories (SRAMs), erasableprogrammable read-only memories (EPROMs), flash memories, electricallyerasable programmable read-only memories (EEPROMs), phase change memory(PCM), magnetic or optical cards, or any other type of media suitablefor storing electronic instructions.

Accordingly, embodiments of the invention also include non-transitory,tangible machine-readable media containing instructions or containingdesign data, such as Hardware Description Language (HDL), which definesstructures, circuits, apparatuses, processors and/or system featuresdescribed herein. Such embodiments may also be referred to as programproducts.

Emulation (Including Binary Translation, Code Morphing, Etc.)

In some cases, an instruction converter may be used to convert aninstruction from a source instruction set to a target instruction set.For example, the instruction converter may translate (e.g., using staticbinary translation, dynamic binary translation including dynamiccompilation), morph, emulate, or otherwise convert an instruction to oneor more other instructions to be processed by the core. The instructionconverter may be implemented in software, hardware, firmware, or acombination thereof. The instruction converter may be on processor, offprocessor, or part on and part off processor.

FIG. 35 is a block diagram contrasting the use of a software instructionconverter to convert binary instructions in a source instruction set tobinary instructions in a target instruction set according to embodimentsof the invention. In the illustrated embodiment, the instructionconverter is a software instruction converter, although alternativelythe instruction converter may be implemented in software, firmware,hardware, or various combinations thereof. FIG. 35 shows a program in ahigh-level language 3502 may be compiled using an x86 compiler 3504 togenerate x86 binary code 3506 that may be natively executed by aprocessor with at least one x86 instruction set core 3516. The processorwith at least one x86 instruction set core 3516 represents any processorthat can perform substantially the same functions as an Intel processorwith at least one x86 instruction set core by compatibly executing orotherwise processing (1) a substantial portion of the instruction set ofthe Intel x86 instruction set core or (2) object code versions ofapplications or other software targeted to run on an Intel processorwith at least one x86 instruction set core, in order to achievesubstantially the same result as an Intel processor with at least onex86 instruction set core. The x86 compiler 3504 represents a compilerthat is operable to generate x86 binary code 3506 (e.g., object code)that can, with or without additional linkage processing, be executed onthe processor with at least one x86 instruction set core 3516.Similarly, FIG. 35 shows the program in the high level language 3502 maybe compiled using an alternative instruction set compiler 3508 togenerate alternative instruction set binary code 3510 that may benatively executed by a processor without at least one x86 instructionset core 3514 (e.g., a processor with cores that execute the MIPSinstruction set of MIPS Technologies of Sunnyvale, Calif. and/or thatexecute the ARM instruction set of ARM Holdings of Sunnyvale, Calif.).The instruction converter 3512 is used to convert the x86 binary code3506 into code that may be natively executed by the processor without anx86 instruction set core 3514. This converted code is not likely to bethe same as the alternative instruction set binary code 3510 because aninstruction converter capable of this is difficult to make; however, theconverted code will accomplish the general operation and be made up ofinstructions from the alternative instruction set. Thus, the instructionconverter 3512 represents software, firmware, hardware, or a combinationthereof that, through emulation, simulation or any other process, allowsa processor or other electronic device that does not have an x86instruction set processor or core to execute the x86 binary code 3506.

FURTHER EXAMPLES

Example 1 provides an exemplary processor comprising: fetch circuitry tofetch an instruction having fields to specify an opcode, locations of atwo-dimensional (2D) matrix and a one-dimensional (1D) vector, and agroup of elements comprising one of a row, part of a row, multiple rows,a column, part of a column, multiple columns, and a rectangular sub-tileof the specified 2D matrix, and wherein the opcode is to indicate a moveof the specified group between the 2D matrix and the 1D vector; decodecircuitry to decode the fetched instruction; and execution circuitry,responsive to the decoded instruction, when the opcode specifies a movefrom 1D, to move contents of the specified 1D vector to the specifiedgroup of elements.

Example 2 includes the substance of the exemplary processor of Example1, wherein the specified group of elements is specified by one of anoperand of the instruction, a part of the opcode, an immediate field,and a programmable control register.

Example 3 includes the substance of the exemplary processor of Example1, wherein the execution circuitry is to transform data being movedbetween the specified 2D matrix and the specified 1D vector register,either before or during the move.

Example 4 includes the substance of the exemplary processor of Example1, wherein the execution circuitry, responsive to the decodedinstruction, when the opcode indicates a move to 1D, is to move, eitherin actuality or with a lazy move, the specified group of elements fromthe specified 2D matrix to the specified 1D vector.

Example 5 includes the substance of the exemplary processor of Example4, wherein the execution circuitry is to perform the lazy move by makingthe specified group of elements available to the execution circuitrywithout actually moving the specified group of elements to the specified1D vector register.

Example 6 includes the substance of the exemplary processor of Example4, wherein the execution circuitry is to perform move in actuality bycopying the specified group of elements from the specified 2D matrix tothe specified 1D vector register.

Example 7 includes the substance of the exemplary processor of Example4, wherein the execution circuitry is to perform the lazy move bytracking the specified group of elements in the specified 2D matrix andproviding pointers to that data to subsequent consumers that need tosource that data.

Example 8 includes the substance of the exemplary processor of Example1, wherein the move instruction further specifies an element size of theelements of the specified 2D matrix and the specified 1D vectorregister, the element size comprising one of a crumb, a nibble, a byte,a word, a doubleword, and a quadword.

Example 9 includes the substance of the exemplary processor of Example1, wherein the move instruction further specifies a vector size of eachof the specified one or more vector registers, the vector sizecomprising one of 64 bits, 128 bits, 256 bits, and 512 bits.

Example 10 provides an exemplary method to be performed by a processor,the method comprising: fetching, using fetch circuitry, an instructionhaving fields to specify an opcode, locations of a two-dimensional (2D)matrix and a one-dimensional (1D) vector, and a group of elementscomprising one of a row, part of a row, multiple rows, a column, part ofa column, multiple columns, and a rectangular sub-tile of the specified2D matrix, the opcode to indicate a move of the specified group from the2D matrix to the 1D vector, decoding, using decode circuitry, thefetched instruction; and responding, using execution circuitry, to thedecoded instruction by moving move, either in actuality or with a lazymove, the specified group of elements from the specified 2D matrix tothe specified 1D vector.

Example 11 includes the substance of the exemplary method of Example 10,wherein the execution circuitry performs the lazy move by making thespecified group of elements available to the execution circuitry toprovide to subsequent consumers of the specified group of elementswithout actually moving the specified group of elements to the specified1D vector register.

Example 12 includes the substance of the exemplary method of Example 10,wherein the execution circuitry is to perform move in actuality bycopying the specified group of elements from the specified 2D matrix tothe specified 1D vector register.

Example 13 includes the substance of the exemplary method of Example 10,wherein the execution circuitry is to transform data being moved fromthe specified 2D matrix to the specified 1D vector register, eitherbefore or during the move.

Example 14 includes the substance of the exemplary method of Example 10,wherein the execution circuitry is to perform the lazy move by trackingthe specified group of elements in the specified 2D matrix and providingpointers to that data to subsequent consumers that need to source thatdata.

Example 15 includes the substance of the exemplary method of Example 15,wherein the move instruction further specifies an element size of theelements of the specified 2D matrix and the specified 1D vectorregister, the element size comprising one of a crumb, a nibble, a byte,a word, a doubleword, and a quadword.

Example 16 includes the substance of the exemplary method of Example 10,wherein the move instruction further specifies a vector size of each ofthe specified one or more vector registers, the vector size comprisingone of 64 bits, 128 bits, 256 bits, and 512 bits.

Example 17 includes the substance of the exemplary method of Example 10,wherein the specified 2D matrix and specified 1D vector are each locatedin one of a vector register, a tile register, and a memory location.

Example 18 provides an exemplary method to be performed by a processor,the method comprising: fetching, using fetch circuitry, an instructionhaving fields to specify an opcode, locations of a two-dimensional (2D)matrix and a one-dimensional (1D) vector, and a group of elementscomprising one of a row, part of a row, multiple rows, a column, part ofa column, multiple columns, and a rectangular sub-tile of the specified2D matrix, and wherein the opcode indicates a move from the specified 1Dvector to the specified 2D matrix, decoding, using decode circuitry, thefetched instruction; and responding, using execution circuitry, to thedecoded instruction by moving contents of the specified 1D vector to thespecified group of elements.

Example 19 includes the substance of the exemplary method of Example 18,wherein the specified group of elements is specified by one of anoperand of the instruction, a part of the opcode, an immediate field,and a programmable control register.

Example 20 provides an exemplary non-transitory machine-readable mediumcontaining instructions, when executed by a processor, cause theprocessor to respond by: fetching, using fetch circuitry, an instructionhaving fields to specify an opcode, locations of a two-dimensional (2D)matrix and a one-dimensional (1D) vector, and a group of elementscomprising one of a row, a column, and a sub-matrix, wherein thespecified group of elements comprises one of a row, part of a row,multiple rows, a column, part of a column, multiple columns, and arectangular sub-tile of the specified 2D matrix, and wherein the opcodeis to indicate a move of the specified group between the 2D matrix andthe 1D vector; decoding, using decode circuitry, the fetchedinstruction; and responding, using execution circuitry, to the decodedinstruction by, when the opcode specifies a move from 1D, to movecontents of the specified 1D vector to the specified group of elements.

Example 21 includes the substance of the exemplary non-transitorymachine-readable medium of Example 20, further comprising, when theopcode specifies a move to 1D, using the execution circuitry to move,either in actuality or with a lazy move, the specified group of elementsfrom the specified 2D matrix to the specified 1D vector

Example 22 includes the substance of the exemplary non-transitorymachine-readable medium of Example 21, wherein the specified group ofelements is specified by one of an operand of the instruction, a part ofthe opcode, an immediate field, and a programmable control register.

What is claimed is:
 1. A processor comprising: fetch circuitry to fetchan instruction, the instruction to specify a vector register of theprocessor as a source of a one-dimensional (1D) vector, a size of dataelements of the 1D vector as any one of 8-bits, 16-bits, 32-bits,64-bits, and 128-bits, a two-dimensional (2D) tile storage of theprocessor, and either one of a row or a column of the 2D tile storage;decode circuitry, coupled with the fetch circuitry, to decode theinstruction; and execution circuitry, coupled with the decode circuitry,to perform operations corresponding to the instruction, the executioncircuitry to store the 1D vector to the specified one of the row or thecolumn of the 2D tile storage.
 2. The processor of claim 1, wherein adimension of the 2D tile storage depends on a size of data elements ofthe 2D tile storage.
 3. The processor of claim 1, wherein the 2D tilestorage has a same number of columns as a number of the data elements ofthe vector register.
 4. The processor of claim 1, further comprising astorage to configure a number of columns of the 2D tile storage.
 5. Theprocessor of claim 1, wherein the instruction is to specify said one ofthe row or the column based on an immediate of the instruction.
 6. Theprocessor of claim 1, wherein the instruction is to specify said one ofthe row or the column based on a value in a register specified by theinstruction.
 7. The processor of claim 1, wherein the processor has aplurality of 2D tile storage, and wherein the instruction has a field tospecify one of the plurality of 2D tile storage as the 2D tile storage.8. The processor of claim 1, wherein the 2D tile storage comprises aplurality of vector registers.
 9. The processor of claim 1, wherein theprocessor further comprises a plurality of mask registers.
 10. Theprocessor of claim 9, wherein the instruction is to specify one of theplurality of mask registers.
 11. The processor of claim 1, wherein theprocessor has a reduced instruction set computing (RISC) architecture.12. The processor of claim 1, wherein the processor is a centralprocessing unit (CPU), and wherein the CPU further comprises a reorderbuffer.
 13. The processor of claim 1, further comprising: a register tostore the 1D vector; and register renaming circuitry to rename theregister.
 14. A system on a chip (SoC) comprising: an memory controller;and a core coupled with the memory controller, the core comprising:fetch circuitry to fetch an instruction, the instruction to specify avector register of the core as a source of a one-dimensional (1D)vector, a size of data elements of the 1D vector as any one of 8-bits,16-bits, 32-bits, 64-bits, and 128-bits, a two-dimensional (2D) tilestorage of the core, and either one of a row or a column of the 2D tilestorage; decode circuitry, coupled with the fetch circuitry, to decodethe instruction; and execution circuitry, coupled with the decodecircuitry, to perform operations corresponding to the instruction, theexecution circuitry to store the 1D vector to the specified one of therow or the column of the 2D tile storage.
 15. The SoC of claim 14,wherein the 2D tile storage has a same number of columns as a number ofthe data elements of the vector register, and wherein the SoC furthercomprises a network processor coupled with the core.
 16. The SoC ofclaim 14, further comprising: a storage to configure a number of columnsof the 2D tile storage; and a coprocessor coupled with the core.
 17. TheSoC of claim 14, wherein the instruction is to specify said one of therow or the column based on one of an immediate of the instruction and avalue in a register specified by the instruction, wherein the 2D tilestorage comprises a plurality of vector registers, and wherein the SoCfurther comprises a network processor coupled with the core.
 18. The SoCof claim 14, wherein the core further comprises a plurality of maskregisters, wherein the instruction is to specify one of the plurality ofmask registers, and wherein the SoC further comprises a coprocessorcoupled with the core.
 19. The SoC of claim 14, wherein the core furthercomprises register renaming circuitry to rename a register used to storethe 1D vector, and wherein the SoC further comprises an image processorcoupled with the core.
 20. A system comprising: a memory; and aprocessor coupled with the memory, the processor comprising: fetchcircuitry to fetch an instruction, the instruction to specify a vectorregister of the processor as a source of a one-dimensional (1D) vector,a size of data elements of the 1D vector as any one of 8-bits, 16-bits,32-bits, 64-bits, and 128-bits, a two-dimensional (2D) tile storage ofthe processor, and either one of a row or a column of the 2D tilestorage; decode circuitry, coupled with the fetch circuitry, to decodethe instruction; and execution circuitry, coupled with the decodecircuitry, to perform operations corresponding to the instruction, theexecution circuitry to store the 1D vector to the specified one of therow or the column of the 2D tile storage.
 21. The system of claim 20,wherein the 2D tile storage has a same number of columns as a number ofthe data elements of the vector register, and wherein the system furthercomprises a mass storage device coupled with the processor.
 22. Thesystem of claim 20, further comprising: a storage to configure a numberof columns of the 2D tile storage; and a Peripheral ComponentInterconnect (PCI) Express bus coupled with the processor.
 23. Thesystem of claim 20, wherein the instruction is to specify said one ofthe row or the column based on one of an immediate of the instructionand a value in a register specified by the instruction, wherein the 2Dtile storage comprises a plurality of vector registers, and wherein thesystem further comprises a communication device coupled with theprocessor.
 24. The system of claim 20, wherein the processor furthercomprises a plurality of mask registers, wherein the instruction is tospecify one of the plurality of mask registers, and wherein the systemfurther comprises a mass storage device coupled with the processor. 25.The system of claim 20, wherein the processor further comprises registerrenaming circuitry, and wherein the system further comprises aPeripheral Component Interconnect (PCI) Express bus coupled with theprocessor.
 26. A method comprising: fetching an instruction, theinstruction specifying a vector register of a processor as a source of aone-dimensional (1D) vector, a size of data elements of the 1D vector asany one of 8-bits, 16-bits, 32-bits, 64-bits, and 128-bits, atwo-dimensional (2D) tile storage of the processor, and either one of arow or a column of the 2D tile storage; decoding the instruction; andperforming operations corresponding to the instruction, includingstoring the 1D vector to the specified one of the row or the column ofthe 2D tile storage.
 27. The method of claim 26, wherein said storingthe 1D vector to the specified one of the row or the column of the 2Dtile storage comprises storing the 1D vector to the specified one of therow or the column of the 2D tile storage which has a same number ofcolumns as a number of the data elements of the vector register.
 28. Themethod of claim 26, further comprising configuring a number of columnsof the 2D tile storage in a storage.
 29. The method of claim 26, furthercomprising determining said one of the row or the column based on one ofan immediate of the instruction and a value in a register specified bythe instruction, and wherein said storing the 1D vector to the specifiedone of the row or the column of the 2D tile storage comprises storingthe 1D vector to the specified one of the row or the column of the 2Dtile storage which comprises a plurality of vector registers.
 30. Themethod of claim 26, further comprising determining one of a plurality ofmask registers specified by the instruction.
 31. The method of claim 26,further comprising renaming a register used to store the 1D vector.